| Allicdata Part #: | ATS-01C-197-C3-R0-ND |
| Manufacturer Part#: |
ATS-01C-197-C3-R0 |
| Price: | $ 3.51 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01C-197-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.18591 |
| 30 +: | $ 3.09981 |
| 50 +: | $ 2.92774 |
| 100 +: | $ 2.75549 |
| 250 +: | $ 2.58325 |
| 500 +: | $ 2.49714 |
| 1000 +: | $ 2.23882 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.05°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal – Heat Sinks offer a solution to many types of heat-related problems or applications, primarily in the realm of cooling, and are used in a variety of applications. The ATS-01C-197-C3-R0 is a heat sink that is widely used in the industry for all types of thermal management.
ATS-01C-197-C3-R0 is designed for dissipating the heat produced by power FETs, transistors, MOS and other large current components. It also works as a cooler solution to optimally dissipate heat produced during heavy loading conditions. The material from which this heat sink is made is aluminum which provides good heat transfer capabilities to keep the device cool even during high current and voltage surges. It also has an excellent ability to dissipate heat quickly and evenly which provides additional stability to the thermal system.
The structure of ATS-01C-197-C3-R0 provides high thermal conductivity and low thermal impedance while maintaining a compact size. The fins on the heat sink also serve to increase the surface area for more efficient heat evacuation. The inner diameter of the material is 19.7mm and the outer diameter is 12mm. The material has a high-saturated vapor pressure and thermal expansion rate over a wide temperature range which helps maintain a uniform thermal transfer.
The ATS-01C-197-C3-R0 comes with an optimized mounting system for a secure fit. The aluminum base and the steel clips offer a strong and reliable grip for easy removal and installation. It also comes with a ceramic and metal adhesive sheet to keep the heat sink securely in place. Although there are various types of heat sinks available on the market, the ATS-01C-197-C3-R0 offers the highest quality and performance for cooling electronics.
The working principle of the ATS-01C-197-C3-R0 is based on the convection process of air circulation. The heat produced by the electronic component enters the heat sink which is made of aluminum, which is a highly efficient heat conductor. The air inside the heat sink helps to dissipate the heat to the surrounding environment. This helps to keep the component cool and working at optimal levels. The aluminum base and the fins also help to increase the surface area for more efficient heat evacuation.
Overall, the ATS-01C-197-C3-R0 is an efficient and reliable thermal solution for applications like power FETs, transistors, MOS and other large current components. It offers highly efficient thermal transfer capabilities and also comes with a secure mounting solution. Its optimized design and efficient working principle make it a preferred choice for many users and businesses.
The specific data is subject to PDF, and the above content is for reference