| Allicdata Part #: | ATS-01C-198-C3-R0-ND |
| Manufacturer Part#: |
ATS-01C-198-C3-R0 |
| Price: | $ 3.58 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X12MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01C-198-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.25710 |
| 30 +: | $ 3.16932 |
| 50 +: | $ 2.99326 |
| 100 +: | $ 2.81717 |
| 250 +: | $ 2.64109 |
| 500 +: | $ 2.55305 |
| 1000 +: | $ 2.28894 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.472" (12.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.21°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are essential components used to dissipate heat generated from electronic components such as transistors, diodes, and other power dissipating devices. Heat sinks are responsible for keeping components temperatures within a specified safe operating temperature range. The ATS-01C-198-C3-R0 is a heat sink specifically designed for high power applications, with a low profile and high heat dissipation capability. This heat sink is ideal for use in low-profile applications, such as in telecom and industrial applications.
The ATS-01C-198-C3-R0 heat sink is designed to mount directly on printed circuit board assemblies. It features a tighter profile for reduced total vertical space, and a lower thermal resistance for improved heat dissipation performance. The device is capable of dissipating up to 25 Watts of power and drawing air through the side channels of the design for improved cooling performance. The heat sink also comes with a Gecko Pad™ thermal compound which improves the thermal interface between the heat sink and the mounted component.
The ATS-01C-198-C3-R0 heat sink operates on the principle of forced convection. The air is drawn through the side channels by the fan mounted on the top of the device. This fan pulls in air from the outside environment, directing it across the fins of the heat sink and accelerating the transfer of heat away from the heat-generating components. This method of heat transfer is more effective than passive cooling solutions, which rely on natural convection to dissipate heat.
The ATS-01C-198-C3-R0 is designed for use in a variety of applications, including telecom, datacom, military, industrial, and power electronics. The device is also ideal for use in compact systems, such as those used in industrial automation and robotics. In addition to its low profile and high thermal resistance capabilities, the ATS-01C-198-C3-R0\'s tight manufacturing tolerances and uniform mounting surface make it an ideal choice for applications with high heat flux demands.
With its high performance and low profile design, the ATS-01C-198-C3-R0 is an ideal thermal solution for a variety of high power applications. The device\'s forced convection allows for improved heat dissipation over passive cooling solutions, and its reduced physical size makes it perfect for low-profile, space-constrained applications. For these reasons, the ATS-01C-198-C3-R0 is the perfect choice for any high power thermal management solution.
The specific data is subject to PDF, and the above content is for reference