ATS-01C-20-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-01C-20-C1-R0-ND

Manufacturer Part#:

ATS-01C-20-C1-R0

Price: $ 3.99
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 54X54X25MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-01C-20-C1-R0 datasheetATS-01C-20-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.62061
30 +: $ 3.41922
50 +: $ 3.21817
100 +: $ 3.01701
250 +: $ 2.81588
500 +: $ 2.61474
1000 +: $ 2.56446
Stock 1000Can Ship Immediately
$ 3.99
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.126" (54.01mm)
Width: 2.126" (54.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.13°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal-Heat Sinks are components that can dissipate the heat generated by electronic circuits efficiently. They are used mainly to prevent overheating components and prevent damage that can be caused due to excessive heat. The ATS-01C-20-C1-R0 is a thermal-heat sink which is specifically designed for electronic and electrical components that operate in medium-to-high power applications.

Application Field and Working Principle of ATS-01C-20-C1-R0

The ATS-01C-20-C1-R0 thermal-heat sink is robust and reliable, with a patented through hole design that provides superior convection and heat dissipation effectiveness when cooled by air or distributed liquid cooling solutions. It is suitable for applications such as power supplies,pwm controllers,AC-DC converters,encoders,IGBT converters and rectifiers. The working principle of ATS-01C-20-C1-R0 heat sink is based on passive heat transfer. The heat sink consists of multiple aluminum layers stacked vertically and secured rigidly together to ensure good contact with the heat source. The high-density aluminum fins act as heat dissipation channels, which pull heat away from the source quickly and evenly.

In addition, the ATS-01C-20-C1-R0 thermal-heat sink uses a patented through hole design to better cool the component faster and more efficiently. The patented through hole design consists of holes of different sizes and depths that are drilled into the heat sink. These holes help to reduce wind resistance on the heat sink, allowing it to more efficiently transfer heat away from the source. This design also reduces the turbulence created by air flow and provides a more consistent cooling rate across the surface of the heat sink.

The ATS-01C-20-C1-R0 thermal-heat sink is also designed with a low thermal resistance, allowing for quick and efficient heat transfer from the component to the heat sink. The sink also features a Zero-Cross guard technology which helps to reduce EMI interference and delivers better electrical insulation. The thermal-heat sink is also resistant to corrosion and has a wide operating temperature ranging from -40°C to +125°C. This makes it suitable for applications in a range of extreme environmental conditions.

The ATS-01C-20-C1-R0 thermal-heat sink is a reliable and cost-effective solution for thermal management in medium-to-high power applications. It features superior performance and robust construction, which make it an ideal choice for a range of different applications. The through hole design and low thermal resistance make this sink an ideal choice for improving the cooling and performance of electronic and electrical components.

The specific data is subject to PDF, and the above content is for reference

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