| Allicdata Part #: | ATS-01C-20-C3-R0-ND |
| Manufacturer Part#: |
ATS-01C-20-C3-R0 |
| Price: | $ 4.67 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01C-20-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.19895 |
| 30 +: | $ 3.96543 |
| 50 +: | $ 3.73225 |
| 100 +: | $ 3.49896 |
| 250 +: | $ 3.26570 |
| 500 +: | $ 3.03243 |
| 1000 +: | $ 2.97412 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.21°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-01C-20-C3-R0 is an advanced type of thermal heat sink. It can be used in a variety of applications, but its primary use is for high-power semiconductor devices. Heat sinks are devices used to move and dissipate heat away from the component that generates it. By dissipating the heat away from the component, it can operate within its optimal temperature range and, consequently, provide better performance.
The ATS-01C-20-C3-R0 is designed to offer maximum heat dissipation. It utilizes a patented low-profile pin-fin geometry and optimized airflow channels to move heat away from the component in an efficient manner. This heat sink also features a high thermal conductivity material, which helps to transfer the heat from the component quickly. In addition, the pin-fins are arranged in an optimally designed pattern and feature a rounded end for increased surface contact, thus increasing thermal transfer.
The heat sink’s working principle is based on the convection principle, which states that warm air rises and cool air will sink. The pin-fins take advantage of this principle, as the rising warm air causes a pressure differential between the top and bottom of the pin-fin. This differential creates a wind force, which pulls more cool air onto the base of the pin-fin and pushes the warm air up and out of the heat sink. This process, known as convective heat transfer, is the most efficient way to dissipate heat.
The ATS-01C-20-C3-R0 thermal heat sink is the perfect choice for high-power semiconductor applications. It is a lightweight, cost-effective option that offers optimal performance and reliability. It has an efficient thermal design that can help to keep the component operating at optimal temperatures and minimize the risk of overheating or damage. It is also designed with a high degree of flexibility, allowing for the easy integration of additional components or modifications as needed.
The ATS-01C-20-C3-R0 thermal heat sink is a great choice for a wide range of applications. It provides optimal thermal transfer with a lightweight construction and a cost-effective design. It utilizes a patented low profile pin-fin geometry and optimized airflow channels to ensure maximum heat dissipation. It also offers a high degree of flexibility, allowing for easy customization and integration of additional components. With its efficient operation and reliable performance, the ATS-01C-20-C3-R0 thermal heat sink is the ideal choice for high-power semiconductor devices.
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