| Allicdata Part #: | ATS-01C-201-C3-R0-ND |
| Manufacturer Part#: |
ATS-01C-201-C3-R0 |
| Price: | $ 3.78 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X12MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01C-201-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.43539 |
| 30 +: | $ 3.24450 |
| 50 +: | $ 3.05361 |
| 100 +: | $ 2.86278 |
| 250 +: | $ 2.67193 |
| 500 +: | $ 2.48108 |
| 1000 +: | $ 2.43337 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.472" (12.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.29°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal solutions have become a critical component of many modern technologies. For this reason, manufacturers have designed thermal solutions to effectively dissipate heat generated by devices in almost any application. The ATS-01C-201-C3-R0 is a type of thermal solution specifically designed for industrial applications. This article explores the application field and working principle of the ATS-01C-201-C3-R0.
The ATS-01C-201-C3-R0 is a type of thermal solution typically used in industrial applications such as machinery, computer chips, and other electronic components that generate heat. It is designed to dissipate this heat in order to protect these components from damage caused by excessive heat. The ATS-01C-201-C3-R0 features a copper base and highly efficient aluminum fins designed to maximise heat dissipation while minimising space requirements.
At the heart of this thermal solution is the working principle of thermal conduction. Thermal conduction is the transfer of heat from one object to another through direct contact. In the case of the ATS-01C-201-C3-R0, the copper base absorbs heat from the device and transfers it to the aluminum fins. The fins are then designed to dissipate this heat into the surrounding environment.
In order to make the most of the thermal solution, it is important to ensure that the ATS-01C-201-C3-R0 is properly installed. The fins must be properly oriented to ensure maximum contact with the surrounding environment. The device should also be mounted securely to the device to ensure that it maintains contact with the base. Finally, the thermal solution should be installed in an area that receives plenty of airflow to maximize heat dissipation.
Fully understanding the application field and working principle of the ATS-01C-201-C3-R0 is essential in order to make the most of its features. Used properly, the ATS-01C-201-C3-R0 can be an effective way to protect sensitive components from the damaging effects of heat. Its efficient design makes it suitable for use in nearly any type of industrial application.
The specific data is subject to PDF, and the above content is for reference