| Allicdata Part #: | ATS3172-ND |
| Manufacturer Part#: |
ATS-01C-25-C2-R0 |
| Price: | $ 6.25 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X25MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: | ATS-01C-25-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 5.62590 |
| 10 +: | $ 5.47092 |
| 25 +: | $ 5.16726 |
| 50 +: | $ 4.86322 |
| 100 +: | $ 4.55925 |
| 250 +: | $ 4.25530 |
| 500 +: | $ 3.95135 |
| 1000 +: | $ 3.87536 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.26°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is a crucial aspect of system design. To ensure peak performance of a system, design engineers must ensure that their components run within their specified temperature range and dissipate unwanted heat efficiently. The ATS-01C-25-C2-R0 Thermal - Heat Sink is an efficient and reliable thermal management solution designed to maximize component performance and lifespan by providing maximum cooling efficiency and optimal heat dissipation.
The ATS-01C-25-C2-R0 is a standard-sized, cylindrical heat sink, made from aluminum and copper. It measures 25mm in diameter and is equipped with two rows of eight fins for optimized thermal performance and heat dissipation. The fins, made from copper, incorporate a unique double-layer design, which ensures efficient heat transfer and thermal air turbulence, maximizing heat dissipation. The heat sink is also equipped with an integrated heat spreader, which distributes heat evenly across the entire heat sink surface.
The ATS-01C-25-C2-R0 is designed to provide cooling solutions for a wide range of applications, including power conversion, automotive electronics, telecommunications, consumer electronics, ICT, industrial electronics, and more. It can also be used to cool system-level components, such as CPUs, GPUs, memory, and FPGAs. The heat sink’s broad range of applications makes it a versatile thermal management solution for many types of electronic systems.
The ATS-01C-25-C2-R0 is designed to be highly efficient in its heat dissipation capabilities. It is designed to dissipate heat quickly and efficiently, and can provide superior cooling performance at high operating temperatures. The heat sink’s highly efficient design also ensures low noise emission levels, minimizing acoustic pollution and allowing it to be used in quiet environments. The ATS-01C-25-C2-R0’s low power consumption and compact size make it an ideal solution for space-constrained applications, such as mobile phones and portable electronics.
The ATS-01C-25-C2-R0 is designed for easy installation and can be installed in a variety of ways, making it ideal for a wide range of environmental conditions. The heat sink’s unique design and construction also make it highly resistant to extreme temperatures and corrosive environments. With its high performance levels and broad range of applications, the ATS-01C-25-C2-R0 is an ideal thermal management solution for many types of electronic systems.
The specific data is subject to PDF, and the above content is for reference
ATS-01C-25-C2-R0 Datasheet/PDF