| Allicdata Part #: | ATS-01C-36-C1-R0-ND |
| Manufacturer Part#: |
ATS-01C-36-C1-R0 |
| Price: | $ 5.26 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 36.83X57.6X11.43MM |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01C-36-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.73067 |
| 30 +: | $ 4.46796 |
| 50 +: | $ 4.20512 |
| 100 +: | $ 3.94235 |
| 250 +: | $ 3.67953 |
| 500 +: | $ 3.41671 |
| 1000 +: | $ 3.35100 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.450" (36.83mm) |
| Width: | 2.267" (57.60mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.450" (11.43mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.81°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Heat sinks are components used to dissipate heat from a device. They are often used with electrical components such as integrated circuits, transistors, or power resistors, to reduce their temperature and thus allow a higher operating temperature range. Heat sinks come in various shapes and sizes, and the type of heat sink chosen for a particular application is usually dictated by the application itself. The ATS-01C-36-C1-R0 Heat Sink is one of the more popular models.
ATS-01C-36-C1-R0 Application Field and Working Principle
The ATS-01C-36-C1-R0 Heat Sink is designed for and used in a wide variety of applications, from automotive to consumer electronics. This particular model is a highly efficient heat sink that is capable of dissipating heat from components at high temperatures. It has an aluminum alloy construction and a bright silver finish that enhances its surface area. The model also features an integrated center pin which works to generate a minimum of pressure drop across the device.
This model Heat Sink is designed with a flat, broad base that allows for uniform cooling. This ensures that all heat generated by the component is evenly dissipated. The increased surface area also provides more contact from the fan or other cooling mechanism, leading to greater thermal dissipation. Additionally, the heat sink has several fins, which provide increased convective heat exchange rates.
The model also utilizes an advanced thermal interface material (TIM). This type of material, often referred to as a \'thermal grease\', serves to fill small gaps between the heat sink and the component being cooled. TIM prevents large temperature gradients from forming during operation and helps further increase thermal dissipation.
The ATS-01C-36-C1-R0 Heat Sink is engineered to deliver optimum performance in cooling. It is designed to handle environmental extremes and is compatible with a range of fan sizes, from 40mm to 120mm. By providing an efficient heat dissipation system for high temperature components, the ATS-01C-36-C1-R0 Heat Sink is ideal for any application that requires efficient heat dissipation.
The specific data is subject to PDF, and the above content is for reference