ATS-01C-40-C1-R0

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Thermal management is an important consideration for a wide range of electronic components. It is especially vital when dealing with high-powered chips, as the heat generated by these components must be effectively dissipated. This is where thermal-heat sinks come into play. Heat sinks are designed to decrease the temperature of a component by providing an effective path for the heat from the component to escape into the surrounding environment. The ATS-01C-40-C1-R0 heat sink is one example of a popular thermal-heat sink.

The ATS-01C-40-C1-R0 heat sink is a type of cooper-finned heat sink. It features a fin design that is able to maximize air convection while maximizing heat transfer from the component to the ambient environment. The fins also have an anodized protective coating to prevent corrosion of the copper. The ATS-01C-40-C1-R0 heat sink has a fin height of 40 millimeters, and the overall size of the heat sink is 317mm x 45mm x 40mm (length x width x height). It weighs around 420 grams.

The ATS-01C-40-C1-R0 heat sink is designed to be used in a variety of applications including power electronics, data centers, server racks, industrial automation, automotive electronics, and more. It is especially useful in situations where high-powered components require an effective thermal management solution, as it is capable of dissipating up to 23 watts of heat. It is also designed to be compatible with a wide range of socket types and mounting systems, including but not limited to Intel’s LGA 1156, LGA 1155, LGA 1150, and AMD’s FM2, FM1, AM2+, and AM3.

The ATS-01C-40-C1-R0 heat sink operates using natural air convection. This means that it depends on the ambient air surrounding the heat sink to cool the heated area within the heat sink. By utilizing the natural flow of air, the heat sink will be able to cool the component faster and more effectively than other thermal-heat sink solutions. This natural air convection process is made even more effective with the fin design of the heat sink, which helps to maximize the amount of air that is able to circulate around the component.

In addition to relying on the ambient air for cooling, the ATS-01C-40-C1-R0 heat sink also utilizes a copper heat spreader. The copper heat spreader is designed to quickly absorb and dissipate heat away from the component. This helps to further improve the cooling capabilities of the heat sink, as the copper is an excellent conductor of heat.

Overall, the ATS-01C-40-C1-R0 heat sink is an effective thermal-heat sink solution for a variety of applications. It is able to quickly and effectively dissipate heat away from the component, utilizing natural air convection and the copper heat spreader. It is also designed to be compatible with a variety of socket types and mounting systems, making it easy to integrate into any system. As such, it is no surprise that the ATS-01C-40-C1-R0 heat sink is a popular choice for those looking for an effective thermal management solution.

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