| Allicdata Part #: | ATS-01C-44-C3-R0-ND |
| Manufacturer Part#: |
ATS-01C-44-C3-R0 |
| Price: | $ 3.39 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X15MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01C-44-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.07881 |
| 30 +: | $ 2.99586 |
| 50 +: | $ 2.82933 |
| 100 +: | $ 2.66295 |
| 250 +: | $ 2.49652 |
| 500 +: | $ 2.41329 |
| 1000 +: | $ 2.16364 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 20.62°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Introduction to Thermal - Heat Sinks
Thermal - Heat Sinks are thermal management devices used for cooling electronic components such as semiconductor chips, CPUs, GPUs, and many other processors. They are also used extensively in the automotive industry for cooling engines and braking systems. Heat sinks can be constructed from a range of materials such as aluminum, copper, or steel, and are designed to capture and dissipate excess heat away from components or systems generated by an increase in temperature.
Introduction to ATS-01C-44-C3-R0
The ATS-01C-44-C3-R0 is a compact Heat Sink designed for cooling various integrated circuits (ICs) in telecommunication, automotive, industrial, and other applications. It is constructed from aluminum, which provides excellent thermal conductivity, durability, and low weight. The ATS-01C-44-C3-R0 is available in a variety of sizes to meet the thermal requirements of different ICs. It includes an integrated cooling fan for improved air circulation, and it is capable of operating at temperatures of up to 150°C.
Application Field of ATS-01C-44-C3-R0
The ATS-01C-44-C3-R0 is primarily used to cool ICs in telecommunication, automotive, industrial, and other applications. In telecommunication, it is commonly used to cool mobile devices such as cell phones and broadband routers. In the automotive industry, it is used to cool engine components, as well as braking and steering systems. In industrial applications, it is used in a range of computer, server, and aerospace systems. It can also be used in a variety of medical, scientific, and consumer electronics applications.
Working Principle of ATS-01C-44-C3-R0
The ATS-01C-44-C3-R0 works by utilizing convection and conduction to dissipate heat away from the IC. Convection occurs when the heat sink is exposed to air circulation, which draws heat away from the IC and into the Heat Sink. Conduction occurs when the aluminum heat sink material absorbs the heat from the IC and distributes it to the rest of the heat sink. The air circulation provided by the integrated fan helps to further increase the rate of cooling. The Heat Sink also features fins that increase the surface area for improved heat dissipation.
Conclusion
The ATS-01C-44-C3-R0 is an excellent choice for cooling a variety of ICs in a range of applications. Its aluminum construction ensures excellent thermal conductivity, durability, and low weight. It includes an integrated cooling fan for improved air circulation, and it is capable of operating at temperatures up to 150°C. The ATS-01C-44-C3-R0 utilizes convection and conduction to dissipate heat away from the IC, and its fins increase the surface area for improved heat dissipation.
The specific data is subject to PDF, and the above content is for reference