| Allicdata Part #: | ATS-01C-48-C3-R0-ND |
| Manufacturer Part#: |
ATS-01C-48-C3-R0 |
| Price: | $ 3.82 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X35MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01C-48-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.47004 |
| 30 +: | $ 3.27726 |
| 50 +: | $ 3.08448 |
| 100 +: | $ 2.89170 |
| 250 +: | $ 2.69892 |
| 500 +: | $ 2.50614 |
| 1000 +: | $ 2.45794 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.78°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat sinks are important components in computer systems and other electronic equipment. ATS-01C-48-C3-R0 is a type of thermal - heat sink used in a diverse range of applications. In this article, we will discuss its application field and working principle.
Application of ATS-01C-48-C3-R0
The ATS-01C-48-C3-R0 is a heat sink designed for use in small to medium power electronics equipment. It is designed to be secured on the printed circuit board with bolts and nuts, providing thermal protection of critical components. Its robust construction and innovative design make it suitable for use in a wide variety of applications, including telecommunications, power transmission, medical, and industrial instrumentation.
The ATS-01C-48-C3-R0 also provides superior thermal protection for a large number of high-performance integrated circuits. Its highly efficient design results in a low total power dissipation and low on-resistance, allowing the installer to realize improved system performance with reduced power consumption. Due to its high thermal conductivity, the ATS-01C-48-C3-R0 can be used in a variety of temperature-limited environments, such as communications, military, industrial, and aerospace applications.
Additionally, the ATS-01C-48-C3-R0 features an innovative design, including a low-thermal resistance heat sink and a high-thermal conductivity base. This allows it to dissipate heat quickly and efficiently, keeping critical components cooler and providing improved system performance. The ATS-01C-48-C3-R0 also features a low-profile and compact design, allowing it to be used in a wide variety of applications.
Working Principle of ATS-01C-48-C3-R0
The ATS-01C-48-C3-R0 utilizes an innovative thermal design principle to ensure highly efficient cooling. When heat is generated by high-performance electronic components, the heat is dissipated through the heat sink. This heat is then absorbed by the heat sink\'s substrate, which is connected to a cooling fan. The fan then blows cool air over the heat sink, cooling it down and allowing it to dissipate the heat generated by the components.
The ATS-01C-48-C3-R0 also features a heat pipe design, which enables increased heat transfer. The heat pipe is filled with a thermal-conductive liquid, which helps to transfer the heat from the heat sink to the heat pipe, allowing it to be dissipated in its entirety. This design provides increased efficiency, resulting in a cooler operation and improved system performance.
The ATS-01C-48-C3-R0 also utilizes a highly efficient air-flow design, which enables the heat sink to absorb more heat from the components, as well as a fan speed control feature. This fan speed control feature is especially useful when the system is operating in hotter environments, as it helps to keep the system cooler and improve system performance.
Conclusion
The ATS-01C-48-C3-R0 is a highly efficient thermal - heat sink designed for use in a variety of applications. Its robust construction and high-performance design make it ideal for use in telecommunications, power transmission, medical, and industrial instrumentation. It features a low profile design, as well as a highly efficient air-flow design and heat pipe for improved heat dissipation. Additionally, its highly efficient cooling system and fan speed control feature provide improved system performance and cooler operation.
The specific data is subject to PDF, and the above content is for reference