| Allicdata Part #: | ATS-01C-56-C3-R0-ND |
| Manufacturer Part#: |
ATS-01C-56-C3-R0 |
| Price: | $ 3.77 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X15MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01C-56-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.42405 |
| 30 +: | $ 3.33123 |
| 50 +: | $ 3.14622 |
| 100 +: | $ 2.96113 |
| 250 +: | $ 2.77603 |
| 500 +: | $ 2.68350 |
| 1000 +: | $ 2.40589 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 17.86°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are common components of electrical and electronic equipment, used extensively to provide cooling in a wide range of applications. The ATS-01C-56-C3-R0 is a thermal heat sink designed to dissipate heat from electrical or electronic components. This thermal solution dissipates heat away from the component, allowing it to perform more efficiently and alleviate the possibility of thermal failures.
The ATS-01C-56-C3-R0 is a versatile and effective heat sink, designed to meet the needs of a variety of applications. Its housing is made from cast aluminum and chrome-plated brass, providing a lightweight but robust structure. The dimensions of the sink are 5.5 x 5.25 x 1.1 inches (14 x 13 x 2.8 cm) and it weighs only 2.3 lbs (1.03 kg). The top and bottom surfaces of the thermal heat sink are provided with tapered fins, allowing for maximum heat dissipation.
The design of the ATS-01C-56-C3-R0 gives it the ability to function effectively in a wide variety of scenarios. It can be used in applications that need high-density cooling, such as motor controllers, LED lights, power supplies, and more. Additionally, the thermal solution is well suited for low-power applications, such as computer memory and data processing, and can also be used in medical devices to regulate temperature.
The working principle of the ATS-01C-56-C3-R0 thermal heat sink is straightforward. Heat is generated by electrical or electronic components and is dissipated through the heat sink\'s fins. The fins serve to improve the thermal conductivity and airflow, allowing the heat to transfer away from the component and be dispersed into the atmosphere. This ensures that the component is able to operate at a safe and optimal temperature.
In summary, the ATS-01C-56-C3-R0 is a reliable and effective heat sink solution, designed to provide superior thermal management in a variety of applications. Its construction of cast aluminum and chrome-plated brass ensures maximum heat dissipation, and its small size and light weight make it an ideal thermal solution for small electronic devices. The working principle of the heat sink is based on dissipating heat away from the component to ensure optimal temperature control. All of these features make the ATS-01C-56-C3-R0 a great choice for any thermal management needs.
The specific data is subject to PDF, and the above content is for reference