ATS-01C-70-C2-R0

Heat Sinks are essential components within the majority of electronic components that dissipate thermal energy in order to keep the device operating smoothly and reliably. Without a heat sink, the electronics would overheat quickly and cease functioning, if not fail catastrophically. Manufacturers of heat sink products often refer to the “total thermal resistance”, which they define as the temperature difference of the component being cooled and the ambient temperature. If all other factors are kept constant, the higher the thermal resistance the cooler the component.

The ATS-01C-70-C2-R0 is one type of heat sink designed specifically for MIL-EUR physical format circuit boards. This type of heat sink has an overall dimension of 70.0 mm x 70.0 mm x 8.0 mm and is crafted from a foramen material that offers excellent thermal characteristics. Its unique design allows it to act as a thermal bridge, transferring heat from the electronic component connections to the metal housing. Another benefit of the ATS-01C-70-C2-R0 design is that its four corner mounting holes allow it to be attached directly to a circuit board, eliminating the need for additional mounting hardware.

In addition to having a high thermal resistance, the ATS-01C-70-C2-R0 also offers superior heat dissipation. This is achieved by virtue of its six-finned heat sink design, which captures more ambient air than regular thermal isolators and outperforms one-piece heat sinks. By using two fins for each side of the heat sink, more surface area is exposed to surrounding air, therefore taking more heat away from the electronic components. The ATS-01C-70-C2-R0 also uses airless electronic connections which improve the heat transfer compared to typical electronic connections that rely on air gaps.

The working principle of the ATS-01C-70-C2-R0 heat sink is based on a combination of both convection and conduction, which results in a highly efficient heat dissipation. The combination of the six-finned design and airless connections creates a bridge between the electronic components and the metal housing, allowing heat to be quickly drawn away from the components and transferred through the metal to the fins. The fins are then exposed to the surrounding air, which works to wick away the heat, resulting in a cooler electronic package.

The ATS-01C-70-C2-R0 heat sink is suitable for a variety of applications where thermal management is critical. This includes, but is not limited to, telecommunication systems, automotive infotainment systems, servers, computers, consumer electronics and a variety of industrial applications. The ATS-01C-70-C2-R0 is also suitable for small to medium size electronic components that require extreme thermal transfer.

In conclusion, it can be said that the ATS-01C-70-C2-R0 heat sink is a high performance thermal solution for a variety of electronic circuitry applications. It’s compact size, six-finned design, and low overhead mounting method make it an ideal choice in systems where thermal management is essential. The ATS-01C-70-C2-R0 is capable of transferring thermal energy quickly from small to medium size electronic components and can significantly improve the operating performance of these devices.