ATS-01D-112-C3-R1

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Rectangular, Fins
Length:	2.362" (60.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.500" (12.70mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	26.38°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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ATS-01D-112-C3-R1 Thermal - Heat Sink Application Field and Working Principle

Thermal - Heat Sinks are designed to efficiently transfer thermal energy away from hot components, and have long been employed in a variety of electronic equipment and components. Thermal - Heat Sinks, with respect to the ATS-01D-112-C3-R1 device specifically, are of particular value in various applications like, but not limited to: general-purpose audio equipment, optoelectronic and electrical power systems, microprocessors, and other similar electronic components. The ATS-01D-112-C3-R1 specifically is a single resilient thermal - Heat Sink that is capable of dissipating heat energy from components through fluid dynamic air motion circulation. This device, engineered with advanced fin array technology, is particularly effective at reducing temperatures when applied to any heat generating device or component.The device is easy to install with standard mounting hardware, and is versatile enough to fit into all types of enclosures and equipment architectures. Designed with a tapered fin array, the ATS-01D-112-C3-R1 is best used for applications which require high air flow over a limited area or require optimized thermal performance. The main principle of use employed with this device is convection cooling, which is a process of exchanging heat between surfaces by means of a convective flow of air or other fluid around the surface. Convection works through several simple physics principles. When a hot surface is in contact with air, it will warm up the air around it and then it will start to rise or ascend, leaving a space for cooler air to take its place. This type of convective heat transfer is used in ATS-01D-112-C3-R1 to control the temperature of a component or system.As heat is produced by the component, the heat is conducted to the fins of the ATS-01D-112-C3-R1, whereupon heat energy is transferred away from the component by the device via convection. This process, in turn, works to increase the air temperature around the heat sink by rising the thermal gradient. This rise in air temperature increases the speed of the convective air flow, reducing the overall heat of the component system.The cumulative result of this principle applied to the ATS-01D-112-C3-R1 device is a temperature decrease of the component it is attached to. This temperature decrease ensures the component in question remains in top operating condition. Additionally, the fin pattern of this thermal - Heat Sink increases air contact with the fins, granting longer-lasting heat removal performance.Simply put, the ATS-01D-112-C3-R1 is a single, resilient thermal - Heat Sink designed to efficiently transfer thermal energy away from hot components, thereby ensuring component system performance in a variety of applications. The device is versatile, easy to install, and provides reliable heat removal thanks to its advanced fin array technology. The device uses principles of convection cooling to transfer heat away from components, thereby decreasing the overall temperature of the system and allowing it to remain in top operating condition.

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