| Allicdata Part #: | ATS-01D-131-C1-R0-ND |
| Manufacturer Part#: |
ATS-01D-131-C1-R0 |
| Price: | $ 4.16 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X20MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01D-131-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.78252 |
| 30 +: | $ 3.57231 |
| 50 +: | $ 3.36206 |
| 100 +: | $ 3.15195 |
| 250 +: | $ 2.94182 |
| 500 +: | $ 2.73169 |
| 1000 +: | $ 2.67917 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.58°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management of electronics requires heat sinks that are able to efficiently absorb and dissipate heat, thereby keeping temperatures stabilised at all times. It is fundamental in order to protect the components from overheating and the consequential negative effect it may have on their performance. The ATS-01D-131-C1-R0 heat sink, provides an ideal solution for thermal control of electronic components in a range of applications.
Design and Features of ATS-01D-131-C1-R0 Heat Sink
The ATS-01D-131-C1-R0 heat sink is a single-unit heat sink made of a low thermal resistance thermoplastics material that offers great heat transfer efficiency. The structure of the heat sink allows air to flow freely, increasing cooling performance. Additionally, it features pins that serve to make the connection between the heat sink and the component easier, thus enabling efficient heat dissipation from the component.
The ATS-01D-131-C1-R0 is a relatively large heat sink, measuring 166 mm in length, 132 mm in width and 69 mm in thickness. This size allows it to be used on large electronic components. Furthermore, the heat sink has a thermal resistance of less than 0.14◦C/W and has a thermal resistance of 0.43 ◦C/W when mounted with a 2U rack mount. This makes it suitable for applications that require greater heat dissipation.
Application Field of ATS-01D-131-C1-R0 Heat Sink
The ATS-01D-131-C1-R0 heat sink is used in a variety of applications, ranging from industrial to consumer electronics. Such applications include LED lighting, automotive electronics, power supplies, A/V equipment, servers, mobile devices, instrumentation and medical equipment.
The ATS-01D-131-C1-R0 heat sink is particularly popular for high-performance computer systems. It is often used to cool central processing units, graphics processing units and other components that require high-power operation. This is due to its high thermal performance and low thermal resistance.
Working Principle of ATS-01D-131-C1-R0 Heat Sink
The basic principle of heat transfer, which is heavily applied in the ATS-01D-131-C1-R0 heat sink, is convection. The heat generated from the component is absorbed by the heat sink and the surrounding air helps to dissipate the heat away. This is made possible by the pins that serve to increase the thermal link between the heat sink and the component, thus improving the heat absorption capability of the heat sink.
The heat generated is then dissipated to the surrounding environment. In order to ensure that the heat is efficiently dispersed, suitable fan systems should be used to create air flow within the system. This is especially important if the ATS-01D-131-C1-R0 is used to cool high-performance components where large amounts of heat may be generated.
Conclusion
In conclusion, the ATS-01D-131-C1-R0 heat sink is an efficient thermal solution for a variety of applications. It can efficiently absorb and dissipate heat and its large size makes it suitable for even large electronic components. Furthermore, it has a low thermal resistance and high thermal performance, making it ideal for high-power components.
The specific data is subject to PDF, and the above content is for reference