| Allicdata Part #: | ATS3284-ND |
| Manufacturer Part#: |
ATS-01D-136-C2-R0 |
| Price: | $ 7.88 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X25MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01D-136-C2-R0 Datasheet/PDF |
| Quantity: | 25 |
| 1 +: | $ 7.08750 |
| 10 +: | $ 6.69627 |
| 25 +: | $ 6.30252 |
| 50 +: | $ 5.90877 |
| 100 +: | $ 5.51477 |
| 250 +: | $ 5.12089 |
| 500 +: | $ 5.02240 |
| 1000 +: | $ 4.92392 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.18°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks is a term used to describe a particularly helpful way of dissipating heat in order to make sure that a device isn’t overheating. Heat Sinks are a type of cooling device used to dissipate heat. While heat sinks are typically used in electronics, they are also used in a variety of applications where dispersing heat is necessary.
One of the most popular types of heat sinks is the ATS-01D-136-C2-R0. This device is used in a variety of applications to help prevent overheating. It works by using a combination of fin structures and a flat aluminum base to dissipate heat from a component which requires cooling. It is an easy, cost-effective way to cool heat-producing components.
The ATS-01D-136-C2-R0 uses a combination of fin structures and a flat aluminum base to dissipate heat from components. The fin structures are made up of thin, spaced apart strips of material, and these help to increase the thermal contact area between the component and the device. The fins also help to create more air flow, which cools the component by transferring the heat away from the component.
The aluminum base of the ATS-01D-136-C2-R0 allows heat to be conducted away from the component and dissipated in the surrounding air. This helps ensure that the component is not operating in an area that has an excessive amount of heat. This is accomplished by the device’s heat spreader design, which creates a large area for heat to dissipate.
The ATS-01D-136-C2-R0 is designed to be used in a wide range of applications. It can be used in computers, automotive systems, power tools, and any other electronic device that requires cooling. In each application, the device is designed to help prevent overheating, which can lead to device failure. Additionally, it can also help to extend the life of a component, as it helps prevent overheating which can wear down components.
The ATS-01D-136-C2-R0 is an effective way to keep components cool. It works by using a combination of fin structures and a flat aluminum base to dissipate heat away from components. This helps to reduce the risk of overheating, which can lead to device failure. Additionally, it can also help to extend the life of a component, as it helps prevent overheating which can wear down components.
The specific data is subject to PDF, and the above content is for reference