ATS-01D-140-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-01D-140-C1-R0-ND

Manufacturer Part#:

ATS-01D-140-C1-R0

Price: $ 3.17
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 25X25X25MM L-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-01D-140-C1-R0 datasheetATS-01D-140-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 2.87721
30 +: $ 2.79909
50 +: $ 2.64361
100 +: $ 2.48812
250 +: $ 2.33264
500 +: $ 2.25488
1000 +: $ 2.02162
Stock 1000Can Ship Immediately
$ 3.17
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 0.984" (25.00mm)
Width: 0.984" (25.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.21°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Introduction

Thermal - Heat Sinks are an important component in various applications, cooling solutions, and electronic systems. In recent years, these materials have become increasingly important in the fields of miniaturization, energy efficiency, and device protection. Heat Sinks are used to dissipate heat away from a component, such as an electrical power component, and to cool it down in order to prevent it from overheating. This paper will discuss the particular application field and working principle of the ATS-01D-140-C1-R0 Heat Sink.

Application Field of the ATS-01D-140-C1-R0 Heat Sink

The ATS-01D-140-C1-R0 Heat Sink is designed to provide an effective cooling solution for high-temperature components. It is most commonly used in automotive, medical, and industrial applications as it offers high thermal resistance while allowing for large-volume air flow. This Heat Sink is also suitable for applications involving exposure to harsh environmental conditions, such as high humidity, dust, and dirt.The ATS-01D-140-C1-R0 Heat Sink can be used for cooling components ranging from small electronic components to larger industrial motors. It is also suitable for cooling large semiconductors, such as power modules and microprocessors. This Heat Sink is designed to provide a high degree of power savings and improved longevity of the component it is used to cool.

Working Principles of ATS-01D-140-C1-R0 Heat Sink

The ATS-01D-140-C1-R0 Heat Sink uses convection-based cooling technology to effectively dissipate heat away from the component. This material features a large surface area that allows for an increase in air flow, which in turn increases the rate of cooling. Additionally, the Heat Sink is constructed from aluminum, which has a high heat dissipation coefficient. This feature helps to maximize the Heat Sink\'s efficiency in dissipating heat away from the component. The ATS-01D-140-C1-R0 Heat Sink also features an optimized design that reduces turbulence and improves air flow characteristics. This feature helps to reduce the overall noise generated by the device, which makes it suitable for applications in noise-sensitive environments. The Heat Sink also features a modular design, which makes it easy to install and maintain. Furthermore, the Heat Sink can be configured with various mounting options, such as bending, pinning, and press-in clips.

Conclusion

The ATS-01D-140-C1-R0 Heat Sink is an ideal cooling solution for high-temperature applications. It is designed to provide maximum cooling efficiency while also allowing for large-volume air flow. Additionally, its optimized design and modular construction make it easy to install and maintain. Furthermore, its aluminum construction and optimized design help to reduce noise. Therefore, this Heat Sink is suitable for a variety of applications, ranging from small electronic components to larger industrial motors.

The specific data is subject to PDF, and the above content is for reference

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