| Allicdata Part #: | ATS3300-ND |
| Manufacturer Part#: |
ATS-01D-150-C2-R0 |
| Price: | $ 4.21 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X25MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01D-150-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.83040 |
| 10 +: | $ 3.72456 |
| 25 +: | $ 3.51767 |
| 50 +: | $ 3.31065 |
| 100 +: | $ 3.10376 |
| 250 +: | $ 2.89684 |
| 500 +: | $ 2.68992 |
| 1000 +: | $ 2.63820 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.82°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are essential components used in a variety of applications that dissipate heat generated by electronic components. They play an important role in helping electronics operate at optimal performance levels. The ATS-01D-150-C2-R0 Thermal Heat Sink is an ideal solution for many applications.
The ATS-01D-150-C2-R0 is designed for a wide range of thermal application demands. It has a fin density of 156 TPI (fins per inch) for greater heat dissipation and efficient space saving in small, confined areas. The aluminum material provides excellent thermal conductivity and low thermal resistance, allowing for maximum heat transfer. Its origin design has been modified to meet today\'s requirements for small, space-saving, and high performance heat sinks.
The ATS-01D-150-C2-R0 Heat Sink is designed for fan-less applications that require a limited airflow. Its extruded heatsink fins provide an increased surface area and maximized air circulation which improves cooling capabilities. To avoid the extruded fins from corroding, the surface of the heatsink is highly polished and impregnated with fluorine. The fins are soldered into the center section for increased durability and improved heat dissipation.
This heatsink has a high efficiency heat dissipation capability and optimal cooling performance. The high quality profile allows for an unobstructed air flow with its unique grooves that divert turbulence. Its flat fins allow for a more efficient airflow without any obstruction, resulting in enhanced heat transfer. The wide fins design also allows for a higher fin density to provide an increased actual surface area by more than double for maximum thermal dissipation.
The ATS-01D-150-C2-R0 is designed to meet a wide range of applications, including board-level cooling, fan-less thermal control, and high power LEDs. It is an ideal solution for applications that require efficient space saving and improved cooling performance. Its alluring profile and polished finish also make it a highly attractive choice for aesthetically pleasing designs.
In summary, the ATS-01D-150-C2-R0 Thermal Heat Sink is an excellent choice for applications that require efficient heat dissipation and space-saving solutions. Its unique design and features make it an ideal component for a variety of applications. Its superior thermal performance and appealing look make it an ideal choice for a variety of thermal solutions.
The specific data is subject to PDF, and the above content is for reference