| Allicdata Part #: | ATS-01D-167-C1-R0-ND |
| Manufacturer Part#: |
ATS-01D-167-C1-R0 |
| Price: | $ 3.12 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X20MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01D-167-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.82933 |
| 30 +: | $ 2.75289 |
| 50 +: | $ 2.60001 |
| 100 +: | $ 2.44705 |
| 250 +: | $ 2.29408 |
| 500 +: | $ 2.21761 |
| 1000 +: | $ 1.98820 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.03°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management has always been an important issue in engineering and science. Heat generated by electrical or mechanical components must be dissipated or removed as it reaches a certain level. Heat sinks are thermal management solutions that ensure components remain cool and operate safely. The ATS-01D-167-C1-R0 is one such heat sink designed to effectively and efficiently dissipate heat.
The ATS-01D-167-C1-R0 is an advanced thermal heat sink which combines advanced technology and materials to allow it to efficiently dissipate heat without the need for excessive power. The device is capable of dissipating heat up to 167 watts, making it an ideal solution for any system hardware which requires a reliable cooling solution. The device is designed to fit into any standard mounting track and is equipped with integrated mounting clips for easy installation.
The ATS-01D-167-C1-R0 features a copper base for optimal heat dissipation and a black anodized aluminum alloy fin for excellent durability and heat dissipation. The device is also designed to be lightweight and have a low profile making it ideal for applications where space is at a premium. Additionally, the device is designed to be aesthetically pleasing and have a low acoustic noise making it ideal for use in entertainment systems. The device also features integrated fan guards for extra protection.
The ATS-01D-167-C1-R0 operational principle is straightforward and is based on the process of natural convection, whereby air is forced over fins within the device, absorbing the heat generated by the components and dissipating it to the surrounding environment. The combination of the copper base and the aluminum alloy fin and fan guards ensures that the device is capable of dissipating heat up to 167 watts with minimal noise production. The device is designed to provide a cooling performance that is reliable and efficient and this is thanks to its materials and design which ensure a consistent air flow.
The ATS-01D-167-C1-R0 heat sink is suitable for a wide range of applications and is most suitable for dissipating heat in high-end PC systems, servers, and gaming consoles. The device can also be used in other areas such as automotive applications, medical equipment, and embedded systems, where there are requirements to dissipate disproportionate levels of heat. The ATS-01D-167-C1-R0 is ideal for ensuring the safe operation of such devices due to its ability to dissipate heat efficiently and consistently.
In conclusion, the ATS-01D-167-C1-R0 is a high-quality thermal heat sink designed to dissipate heat in a variety of applications. The device is constructed from advanced materials to provide a reliable and efficient cooling solution. The device is lightweight, has a low profile and is designed to provide a low noise operation which makes it ideal for media applications. The device is suitable for a wide range of applications and can be used to dissipate heat efficiently in areas such as PC systems, servers, gaming consoles, automotive applications, medical equipment, and embedded systems.
The specific data is subject to PDF, and the above content is for reference