| Allicdata Part #: | ATS3325-ND |
| Manufacturer Part#: |
ATS-01D-173-C2-R0 |
| Price: | $ 4.00 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X30MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01D-173-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.62880 |
| 10 +: | $ 3.52800 |
| 25 +: | $ 3.33194 |
| 50 +: | $ 3.13589 |
| 100 +: | $ 2.93990 |
| 250 +: | $ 2.74390 |
| 500 +: | $ 2.54791 |
| 1000 +: | $ 2.49892 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.72°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is one of the most important aspects of any electronic system or device, and heat sinks can play an important role in controlling thermal management. ATS-01D-173-C2-R0 is a type of heat sink specifically designed for thermal management applications. This article will explain its application field and explain its working principle.
Heat sinks are devices that are used to dissipate heat from an electrical component or a system of components. ATS-01D-173-C2-R0 is designed to be able to dissipate large amounts of heat in high density applications. It features a copper cold plate design with an anodized aluminum center fin and anodized aluminum side fins that provide an effective thermal interface between the component and the heat sink.
The ATS-01D-173-C2-R0 is ideal for applications requiring efficient heat dissipation in high-density environments. The copper cold plate design facilitates efficient transfer of heat away from the components, while the anodized aluminum fin structure provides additional cooling capacity. The combination of these features provides superior performance in thermal management solutions.
ATS-01D-173-C2-R0 can be used in a variety of applications and environments, including high power LED lighting, high-capacity racks and datacenters, storage systems, and more. The device is capable of dissipating large amounts of heat due to its high-efficiency thermal transfer and its ability to be accurately controlled.
The working principle of the ATS-01D-173-C2-R0 is based on the concept of phase change cooling. When a liquid is frozen it releases latent heat of fusion. This latent heat is absorbed by the heat sink and is dissipated through the fins. This allows for effective thermal management as the heat is spread out over a large surface area quickly. This process helps to reduce the temperature of the components quickly as heat is delivered away from them.
In addition to phase change cooling, the device also features a copper cold plate design which helps to further assist in thermal management. The copper cold plate helps to effectively transfer heat away from components and conduct it to the anodized aluminum fins. The fins then help to dissipate the heat away from the components and out into the environment.
The ATS-01D-173-C2-R0 is an efficient and effective thermal management solution. It can be used in high-density applications where efficient heat dissipation is critical. The combination of the copper cold plate design and the anodized aluminum fins provide superior performance and the ability to accurately control the temperature of the components. With its high efficiency and robust design, the ATS-01D-173-C2-R0 is an ideal solution for thermal management applications.
The specific data is subject to PDF, and the above content is for reference