| Allicdata Part #: | ATS-01D-174-C1-R0-ND |
| Manufacturer Part#: |
ATS-01D-174-C1-R0 |
| Price: | $ 3.70 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X35MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01D-174-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.36420 |
| 30 +: | $ 3.27348 |
| 50 +: | $ 3.09154 |
| 100 +: | $ 2.90972 |
| 250 +: | $ 2.72785 |
| 500 +: | $ 2.63691 |
| 1000 +: | $ 2.36412 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.98°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-01D-174-C1-R0 is a type of thermal-heat sink, and it is used to dissipate heat away from high power and high heat electronic components, thus preventing them from overheat damage. This is done by transferring thermal energy away from the components and into the surrounding environment by means of heat absorption and convection.
The ATS-01D-174-C1-R0 consists of two components, a base and a heat sink. The base of the device is usually a flat plate of metal or metal alloy, and it is designed to absorb any heat that is generated by the components. This raw heat is then transferred to the heat sink, which is typically a thin piece of aluminum or other material that is designed to promote thermal convection. The heat sink has a series of fins that are designed to trap the air and further promote thermal convection by drawing in the cool air from the surrounding environment. It also helps to dissipate the energy away from the components by transferring it into a larger area of heat absorption.
The main benefit of using the ATS-01D-174-C1-R0 as a thermal-heat sink is that it is very efficient at transferring heat away from the components and into the surrounding environment. This helps to reduce the chances of the components overheating and thus damaging the electrical components and other components in the system. Additionally, the heat sink is designed to be very lightweight and space efficient, making it ideal for use in confined spaces where it can be used to manage the heat without taking up too much space.
The application of the ATS-01D-174-C1-R0 usually falls into the categories of computers, laptops, printers, and servers, as well as other high-powered electronics. In these cases, it can be used to keep the internal temperatures of the components within acceptable levels, thus preventing them from overheating and potentially becoming damaged.
The ATS-01D-174-C1-R0 is a simple and effective device that can be used to protect the components in a variety of electronic applications from being damaged by excessive heat. Its lightweight design and efficient heat transfer make it a great choice for anyone looking for an effective way to manage the heat generated by high-powered components.
The specific data is subject to PDF, and the above content is for reference