| Allicdata Part #: | ATS-01D-179-C1-R0-ND |
| Manufacturer Part#: |
ATS-01D-179-C1-R0 |
| Price: | $ 3.70 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X30MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01D-179-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.36420 |
| 30 +: | $ 3.27348 |
| 50 +: | $ 3.09154 |
| 100 +: | $ 2.90972 |
| 250 +: | $ 2.72785 |
| 500 +: | $ 2.63691 |
| 1000 +: | $ 2.36412 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.90°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
The ATS-01D-179-C1-R0 is an electronic thermal management component used in cooling systems. It is often found in the form of a metal heatsink, which is a device that disperses and radiates heat away from critical components and sensitive electronic equipment. Thermal management components are necessary to maintain a constant temperature and ensure the safe operation of electronic devices.
Application Field
The ATS-01D-179-C1-R0 is often used in a variety of electrical and electronic applications, such as computers, telecommunications equipment, or network devices. These applications often generate large amounts of heat, and the ATS-01D-179-C1-R0 can effectively dissipate and transfer this heat away from the component or device, thus preventing it from overheating and operating in an inefficient manner.
Working Principle
The ATS-01D-179-C1-R0 utilizes the principles of thermodynamics to effectively move heat away from the component or device. This is achieved by placing a metal heatsink attached to the component or device. As the thermal energy is conducted away from the component or device, the metal heatsink then dissipates this thermal energy into the atmosphere.
The ATS-01D-179-C1-R0 also makes use of air convection to improve heat dissipation. Air convection utilizes natural air currents to whisk away the thermal energy, thus increasing the efficiency of the cooling system. This process occurs when hot air is drawn away from the metal heatsink by the air currents, and replaced with cooler air from one side. This creates a continuous cycle of air circulation within the cooling system, and maximum cooling efficiency.
In summary, the ATS-01D-179-C1-R0 is an effective and reliable thermal management component used in cooling systems in many electronic devices. It makes use of both thermodynamic principles and air convection to efficiently move and dissipate heat away from the component or device. This prevents components from over-heating and allows for optimal operating temperatures and maximum efficiency.
The specific data is subject to PDF, and the above content is for reference