ATS-01D-190-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS3344-ND

Manufacturer Part#:

ATS-01D-190-C2-R0

Price: $ 4.81
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X25MM R-TAB T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-01D-190-C2-R0 datasheetATS-01D-190-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 4.37220
10 +: $ 4.25628
25 +: $ 4.02016
50 +: $ 3.78365
100 +: $ 3.54715
250 +: $ 3.31068
500 +: $ 3.07420
1000 +: $ 3.01508
Stock 1000Can Ship Immediately
$ 4.81
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 3.62°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks is an essential technology for the efficient control of temperature and heat transfer in electrical and electronic systems. The application field and working principle of ATS-01D-190-C2-R0 is a perfect example of how this technology is used.In order to understand the working principle of Thermal - Heat Sinks, it\'s important to know that the basic concept of thermal management is to control the temperatures of components by transferring the heat away from them. This is accomplished by using a material with a higher thermal conductivity than that of the components. Heat sinks are a perfect example of a thermal management component used to transfer the heat away from electrical components due to their high thermal conductivity.The ATS-01D-190-C2-R0 is a universal heat sink designed for use with a variety of electronic components. It is designed in a compact size with a solid aluminum base and an anodized aluminum fin structure. The unique fin structure is designed to be as efficient as possible with both air and liquid cooling systems. The ATS-01D-190-C2-R0 can also be designed for use with a variety of mounting systems such as direct screw, clip, or stick-on mounting.The working principle of the ATS-01D-190-C2-R0 is to transfer the heat away from the components and disperse it into the fin structure. The aluminum base plate works to dissipate the heat from the source components and the fins efficiently disperse it into the surrounding environment. The fins act like tiny heatsinks, dissipating the heat into the air. As the air passes through the fins, it picks up the heat from the fins and carries it away from the source, cooling the components.The ATS-01D-190-C2-R0 has a wide range of applications in a variety of electronic devices such as cell phones, tablets, computers, and game consoles. It can be used to dissipate the heat away from the high power processors used in these devices. Another application of the ATS-01D-190-C2-R0 is in LED lighting applications. LEDs generate a lot of heat in the process of converting electrical energy into light energy, and they can easily overheat if the heat isn’t managed properly. The ATS-01D-190-C2-R0 can be used to dissipate this heat away from the LED and extend its lifetime.Thermal management is an essential technology for most electrical and electronic devices, and the ATS-01D-190-C2-R0 is a great example of how this technology is used. The ATS-01D-190-C2-R0 is designed for a variety of applications and can be used to keep electronic components running at optimal temperatures. It is an efficient and reliable heat sink that can help protect and extend the life of electronic components.

The specific data is subject to PDF, and the above content is for reference

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