| Allicdata Part #: | ATS-01D-20-C1-R0-ND |
| Manufacturer Part#: |
ATS-01D-20-C1-R0 |
| Price: | $ 3.99 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01D-20-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.62061 |
| 30 +: | $ 3.41922 |
| 50 +: | $ 3.21817 |
| 100 +: | $ 3.01701 |
| 250 +: | $ 2.81588 |
| 500 +: | $ 2.61474 |
| 1000 +: | $ 2.56446 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.13°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are an essential element in many different applications. Heat sinks are used to dissipate heat generated within a system, often in the form of radiative energy or thermal energy. Thermal energy is generated by the various components within the system, such as CPUs, Graphics Cards, Motherboards, and other electronic components. If these components generate too much heat, the system can overheat and become unstable. To prevent this, heat sinks are installed to absorb and dissipate the excess heat by the use of fans and other air circulating components. When this is combined with proper air flow management, it can help ensure that any generated heat is removed from the system, thereby keeping it in optimal condition.
The ATS-01D-20-C1-R0 is a type of heat sink designed to provide excellent thermal performance for high-end system components, while still offering a low-cost solution. This heat sink is designed for use in data centre applications, where heat dissipation is a key factor. It is designed out of aluminum alloys to provide maximum durability and maximum dissipation of heat. Additionally, it also has a low thermal resistance, which allows it to provide efficient heat transfer from the system components to the ambient air. This helps to keep the system temperature cool and prevents it from reaching excessive levels. The heat sink is then connected to a power source, usually via a standard fan connector, and the fan then circulates air through the heatsink and to the outside.
The ATS-01D-20-C1-R0 heat sink has been specifically designed for use in data centers, where heat removal is of paramount importance. The aluminum alloy construction helps to dissipate heat quickly, and the low thermal resistance ensures efficient heat transfer from the CPU, motherboard, and other components. The fan also helps to circulate air to help dissipate the heat, and there is an additional thermal cut-off switch in case the temperature rises too high. This helps to provide a safe operating temperature for the components in the system.
Overall, the ATS-01D-20-C1-R0 heat sink is a great, low-cost solution for those looking to provide effective heat dissipation and cooling for their system components. It is efficient, durable, and provides excellent thermal performance. It can be used in a variety of applications, but is particularly suited for use in data centers, where heat removal is essential. It is also relatively simple to install, and can be connected to the system\'s power source either directly or via a fan connector.
The specific data is subject to PDF, and the above content is for reference