| Allicdata Part #: | ATS-01D-20-C3-R0-ND |
| Manufacturer Part#: |
ATS-01D-20-C3-R0 |
| Price: | $ 4.67 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01D-20-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.19895 |
| 30 +: | $ 3.96543 |
| 50 +: | $ 3.73225 |
| 100 +: | $ 3.49896 |
| 250 +: | $ 3.26570 |
| 500 +: | $ 3.03243 |
| 1000 +: | $ 2.97412 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.21°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Introduction to the ATS-01D-20-C3-R0
The ATS-01D-20-C3-R0 is a thermal-heat sink, which is characterized by its exceptional heat resistance. It is a component designed to transfer heat from components, such as CPUs, to a lower temperature location such as case fans. This system is designed to help cool heated parts of a system, enabling them to run better and more reliably.
Application Field of ATS-01D-20-C3-R0
The ATS-01D-20-C3-R0 is designed for computing, video, audio, and telecom applications. It can be applied for a multitude of purposes ranging from home computers to industrial machinery.
It can help keep computer components such as CPUs, GPUs, and RAM running at optimal temperatures by dissipating the heat away from the components and into the casing of the system. It is also designed to be low-profile, so it does not take up a lot of space in a typical system.
This system is often utilized in data centers where the cooling of servers is critical to their performance and reliability. It can also be used in audio and video applications to help reduce or eliminate thermal noise. In telecom applications it can help reduce static interference generated by thermal heat.
Working Principle of ATS-01D-20-C3-R0
The ATS-01D-20-C3-R0 utilizes a combination of heat pipes and heat spreaders to transfer heat away from a component. Heat pipes draw heat away from the component and into the heat spreader, where it is then dispersed throughout the entire system case. This process helps to lower the temperature of the component which in turn helps to improve its performance.
The system is also equipped with a Quick-Cooling Nut which allows for faster heat dissipation by creating a more direct path for the heat to escape from the component. This leads to quicker cooling times and improved performance.
The ATS-01D-20-C3-R0 also utilizes both active and passive cooling methods. Active cooling consists of the use of fans which force cool air over the components. This helps to lower the temperature of the component faster and more efficiently than with passive cooling. Passive cooling consists of heat sinks and radiators which absorb and dissipate heat away from components.
The combination of both active and passive cooling methods allow for increased reliability and improved performance of the system.
Conclusion
The ATS-01D-20-C3-R0 is a thermal-heat sink that is designed to help reduce thermal noise in telecom applications and keep computer components such as the CPU, GPU, and RAM running at optimal temperatures. It utilizes a combination of heat pipes and heat spreaders to draw heat away from components and Quick-Cooling Nut which allows for more direct paths for heat to escape. This system also incorporates both active and passive cooling methods which helps to lower the temperature more quickly and efficiently. All of these features make the ATS-01D-20-C3-R0 an ideal thermal-heat sink for multiple applications.
The specific data is subject to PDF, and the above content is for reference