| Allicdata Part #: | ATS-01D-204-C3-R0-ND |
| Manufacturer Part#: |
ATS-01D-204-C3-R0 |
| Price: | $ 3.94 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X12MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01D-204-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.58596 |
| 30 +: | $ 3.38646 |
| 50 +: | $ 3.18730 |
| 100 +: | $ 2.98809 |
| 250 +: | $ 2.78888 |
| 500 +: | $ 2.58968 |
| 1000 +: | $ 2.53987 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.472" (12.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.54°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important factor in controlling the temperature of sensitive components and systems. In recent years, the demand for thermal management solutions for components such as transistors, microchips, and other electronics has grown steadily. One of the most popular thermal solutions is the ATS-01D-204-C3-R0. This heat sink is a highly efficient device that utilizes its large surface area to dissipate the heat generated by electrical circuits.
The ATS-01D-204-C3-R0 is a rectangular heat sink made of anodized aluminum. Its dimensions are 204 mm x 95 mm x 11.3 mm (8 ″ x 3.7 ″ x 0.44 ″) and is equipped with four mounting holes for easy installation. The device also features a die-cast copper base that provides excellent heat conductivity and stability during operations.
This heat sink is designed for electronic components that require cooling in order to operate efficiently. It is widely used in consumer electronics and industrial automation applications such as LED lighting, server processors, power amplifiers, and semiconductor systems. The ATS-01D-204-C3-R0 is capable of dissipating large volumes of heat up to 10°C/W and is highly efficient in cooling components with high temperatures.
The ATS-01D-204-C3-R0 operates on the principle of forced convection. This means that when the device is heated up, air is circulated around the heat source, cooling it down in the process. It features four channels which allow for maximum airflow, allowing the device to operate at optimal efficiency. The large surface area and highly conductive surface of the heat sink also help improve the cooling efficiency. Additionally, the device is designed for low-noise operation, making it ideal for applications where noise is a concern.
In addition to its great cooling efficiency, the ATS-01D-204-C3-R0 also delivers excellent performance in terms of cost-effectiveness. The device is relatively inexpensive for its size and power and is available in various sizes and configurations, allowing for easy customization. Its excellent thermal dissipation and low-noise operation make it ideal for applications where noise and temperature control are critical.
Overall, the ATS-01D-204-C3-R0 is a great solution for thermal management in both consumer electronics and industrial applications. Its large surface area and high cooling efficiency make it an excellent choice for applications where heat dissipation is a top priority. The device is relatively easy to install and offers excellent cost-effectiveness and performance. In addition, its low-noise operation makes it ideal for applications where noise is a critical parameter.
The specific data is subject to PDF, and the above content is for reference