| Allicdata Part #: | ATS3364-ND |
| Manufacturer Part#: |
ATS-01D-209-C2-R0 |
| Price: | $ 6.82 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X10MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01D-209-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 6.13620 |
| 10 +: | $ 5.96862 |
| 25 +: | $ 5.63699 |
| 50 +: | $ 5.30536 |
| 100 +: | $ 4.97372 |
| 250 +: | $ 4.64214 |
| 500 +: | $ 4.31056 |
| 1000 +: | $ 4.22766 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.27°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are designed to help with cooling electronic devices and systems. The ATS-01D-209-C2-R0 is a device that is designed to function as both a passive heat sink and a cooling fan to dissipate heat from its immediate vicinity. It is a highly efficient thermal solution and is widely used in various industries, from automotive to consumer electronics.
The ATS-01D-209-C2-R0 is constructed from high-grade aluminum alloy and consists of two louvered fins that run along its base and one large fan. The fan is then used to draw air through the fins, which increases the surface area and increases the rate of cooling. This provides efficient cooling and better heat dissipation than traditional air-cooled heat sinks.
The ATS-01D-209-C2-R0 has a simple working principle. It uses the natural process of convection to draw air up through the louvers of the fins, which increases the cooling efficiency by dispersing the heat generated by the device. The fan then pushes the warm air out of the system, which further increases the cooling efficiency of the device. The combination of the two processes creates a much higher thermal efficiency than using a traditional air-cooled heat sink.
The ATS-01D-209-C2-R0 is most commonly used to cool electronic components and systems such as CPUs, GPUs, and other computing devices. It is also widely used in the automotive industry, for engine and transmission cooling, as well as in refrigeration systems. The device is highly durable, and its small size and weight make it ideal for use in cramped or hard-to-reach places.
The ATS-01D-209-C2-R0 is a highly efficient and reliable thermal solution for any application. It provides excellent cooling performance, is lightweight and compact, and is easy to install and maintain. It is a great choice for both commercial and industrial applications, where cooling and heat dissipation are required.
The specific data is subject to PDF, and the above content is for reference