| Allicdata Part #: | ATS-01D-25-C1-R0-ND |
| Manufacturer Part#: |
ATS-01D-25-C1-R0 |
| Price: | $ 4.81 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01D-25-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.32621 |
| 30 +: | $ 4.08555 |
| 50 +: | $ 3.84527 |
| 100 +: | $ 3.60499 |
| 250 +: | $ 3.36466 |
| 500 +: | $ 3.12432 |
| 1000 +: | $ 3.06424 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.25°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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.ATS-01D-25-C1-R0 Application Field and Working Principle
The ATS-01D-25-C1-R0 is a type of heat sink designed to allow heat to escape from an electronic device, such as a computer or laptop. Heat sinks are integral components of any electronic device and provide a safe and effective way to dissipate heat generated from the device. Heat sinks are typically constructed of aluminum or copper, and come in a variety of shapes and sizes.
The ATS-01D-25-C1-R0 is designed to be mounted onto an electronic device’s main board. It utilizes a patented ‘Contact Technology’ to disperse heat from the device more quickly and efficiently than traditional heat sinks. The Contact Technology works by allowing air to flow around various surfaces on the heat sink, creating a more efficient path for heat to dissipate.
The ATS-01D-25-C1-R0 is a type of heat sink specifically designed for consumer electronics and laptops. It is a stackable heat sink, meaning multiple heat sinks can be used together to dissipate heat more efficiently. The heat sink has a reference thermal resistance of 0.5 °C/W, meaning it transfers heat at a rate of 0.5 °C/W.
The ATS-01D-25-C1-R0 is designed to operate in temperatures ranging from -20° C to 70° C. It is available in a range of sizes, including 25 x 40mm, 25 x 50mm, and 25 x 60mm. This allows for the heat sink to be customized for different applications. It is also compatible with Intel and AMD processors.
In summary, the ATS-01D-25-C1-R0 is a type of heat sink designed to dissipate heat quickly and efficiently from electronic devices. It utilizes a patented Contact Technology to allow air to flow around various surfaces, creating a more efficient path for heat to dissipate. It is stackable and comes in a variety of sizes, making it versatile for different applications. It is compatible with Intel and AMD processors and operates at temperatures ranging from -20° C to 70° C.
The specific data is subject to PDF, and the above content is for reference