ATS-01D-25-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.362" (60.00mm)
Width:	2.362" (60.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	6.32°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Heat Sinks – ATS-01D-25-C3-R0 Application Field and Working Principle
Heat sinks are used to keep electronic components cool. The ATS-01D-25-C3-R0, for example, is a heat sink with a built-in fan designed to move a large volume of air quickly. This makes it ideal for use in high-powered and mission-critical applications.The ATS-01D-25-C3-R0 is made up of a series of thin metal fins that radiate heat away from the hot components. These metal fins are designed to maximize air flow, and they are often shaped to provide maximum surface area and area-to-surface-area ratio. The fan draws in air from the ambient environment and forces it through the fins, which cools the components down. This efficient process is called convection cooling.When designing a system with an ATS-01D-25-C3-R0, engineers must ensure that the heat sink is positioned correctly so that the fan is facing the hottest components in the system. Also, the entire system must be designed for airflow so that the heated air can be expelled from the system, thus keeping the components cool.The ATS-01D-25-C3-R0 is a versatile heat sink, as it can be used in a wide range of applications and operating environments. In general, it is suitable for temperature ranges between -20°C and +90°C and is rated for atmospheric pressure up to 12000Pa. It is also RoHS compliant and UL 1604 approved, making it safe to use in commercial, industrial, and medical applications.The most common application for the ATS-01D-25-C3-R0 is in power electronics. Power electronics must be kept cool to avoid damage from overheating. The fan and heat sink combination allows heat to be removed quickly and keeps the power electronics from overheating.The ATS-01D-25-C3-R0 is also used in telecommunications and data centers. This heat sink is able to keep CPUs and memory cool in these high-powered applications. In addition, the incredible airflow provided by the fan helps to protect the system’s other components from excessive heat buildup.To conclude, the ATS-01D-25-C3-R0 is a capable heat sink with a fan built-in. Its capacity to draw in and expel large amounts of air makes it an ideal choice for high-powered applications such as power electronics and data centers. Its fan and metal fins provide an efficient convection cooling system, which helps keep components cool and functioning properly.

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