| Allicdata Part #: | ATS-01D-32-C3-R0-ND |
| Manufacturer Part#: |
ATS-01D-32-C3-R0 |
| Price: | $ 5.66 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X36.83X11.43MM T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01D-32-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.08914 |
| 30 +: | $ 4.80669 |
| 50 +: | $ 4.52390 |
| 100 +: | $ 4.24116 |
| 250 +: | $ 3.95842 |
| 500 +: | $ 3.67567 |
| 1000 +: | $ 3.60499 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 1.450" (36.83mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.450" (11.43mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 21.54°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an essential component of many systems that require continuous temperature control for optimal performance. Heat sinks are components designed to dissipate heat as efficiently as possible, and one of the most popular and versatile heat sinks is the ATS-01D-32-C3-R0. This article will cover the application field and working principle of the ATS-01D-32-C3-R0.
The ATS-01D-32-C3-R0 is a type of heat sink designed to provide a high-performance, cost-effective, and versatile solution to thermal management. The design of the ATS-01D-32-C3-R0 provides superior heat dissipation while maintaining a low profile. The flexible design allows for easy installation and compatibility with a variety of materials, making it suitable for a variety of applications.
The ATS-01D-32-C3-R0 is primarily used for cooling and managing heat in small - to medium-size electronics. Its most common application is in consumer electronics such as smartphones, tablets, and laptops. It is also commonly used in industrial applications such as robotics, medical devices, and automotive systems. In addition, it is also used for cooling in gaming PC’s and in data centers.
The ATS-01D-32-C3-R0 is constructed of aluminum or copper, which helps to effectively transfer heat away from the source. The design of the heat sink is such that it has a greater surface area than the same-sized heatsink made from another material. This increased surface area allows for a more efficient transfer of heat away from the source, leading to improved system performance.
The ATS-01D-32-C3-R0 works by dissipating heat away through a combination of convection, conduction, and radiation. The materials used for the heat sink have excellent thermal conductivity, allowing heat to be transferred away from the source with very little resistance. Convection occurs when air movement is present, allowing heat to be removed from the source via air movement. Radiation occurs when the heat is radiated away from the source, allowing it to dissipate into the atmosphere. Finally, conduction occurs when the heat is transmitted through the materials of the heat sink, allowing it to be passed from the source to the atmosphere.
In addition to cooling small – to medium-sized electronics, the ATS-01D-32-C3-R0 can also be used in applications such as mounting thermal sensors and energy efficient cooling systems. Its low profile and flexibility allows for easy installation and compatibility with a variety of materials, making it suitable for a wide range of applications. This makes the ATS-01D-32-C3-R0 an excellent choice for a variety of thermal management needs.
In conclusion, the ATS-01D-32-C3-R0 is a highly efficient, cost effective, and versatile heat sink designed for thermal management needs. Its common uses include cooling and managing heat in small - to medium-sized electronics, mounting thermal sensors, and energy efficient cooling systems. Its low profile and flexibility allow for easy installation and compatibility with a variety of materials, making it an ideal choice for many thermal management projects.
The specific data is subject to PDF, and the above content is for reference