| Allicdata Part #: | ATS3392-ND |
| Manufacturer Part#: |
ATS-01D-59-C2-R0 |
| Price: | $ 4.56 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X30MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01D-59-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.13910 |
| 10 +: | $ 4.02507 |
| 25 +: | $ 3.80167 |
| 50 +: | $ 3.57802 |
| 100 +: | $ 3.35437 |
| 250 +: | $ 3.13075 |
| 500 +: | $ 2.90712 |
| 1000 +: | $ 2.85122 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.94°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-01D-59-C2-R0 is a type of thermal - heat sink that has a wide range of applications. It is typically used in high-density LED lighting applications, and is composed of a copper C110- grade base, aluminum fin construction, and 5/16-inch diameter mounting holes for easy installation. This heat sink dissipates heat by transferring it to a higher-temperature external environment. This allows it to cool electronic systems while maintaining electrical insulation.
The ATS-01D-59-C2-R0 features include low thermal resistance, high efficiency, low noise, and a low corrugated fin design. This low-profile technology helps to improve application reliability while also providing greater space savings over other heat sinks. As opposed to other thermal heat sinks which require additional fans to generate airflow, the ATS-01D-59-C2-R0 has a unique fin design which allows for natural air convection and an optimized thermal transfer rate.
The ATS-01D-59-C2-R0 is ideal for high power applications. It features a high thermal-manageability rating due to its copper base and aluminum fin construction, which helps dissipate heat efficiently. The underlying principles involve thermal-conduction, where heat moves from a higher temperature spot on the internal device to a lower temperature spot on the heat sink. This helps keep the heat away from the sensitive components, preventing their likelihood of thermal damage.
While the installation instructions for the ATS-01D-59-C2-R0 is relatively simple, users should take certain precautions to ensure optimal heat transferring performance. Thermal grease should be applied to the surface of the heat sink and CPU base before installation. After installation, an air gap should be left between the heat sink and the motherboard to maximize air flow. Additionally, too much thermal grease should be avoided since it can create an insulating layer between the heat sink and the CPU, reducing performance.
Overall, the ATS-01D-59-C2-R0 is an effective thermal - heat sink that is designed to help cool electronic systems in high-density LED lighting applications. It features a low thermal-resistance and a low corrugated fin design which help optimize thermal transfer rates. To ensure optimal performance of the ATS-01D-59-C2-R0, users are advised to install and maintain it according to its manufacturer’s instructions.
The specific data is subject to PDF, and the above content is for reference