| Allicdata Part #: | ATS-01D-72-C1-R0-ND |
| Manufacturer Part#: |
ATS-01D-72-C1-R0 |
| Price: | $ 4.43 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X35MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01D-72-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.99042 |
| 30 +: | $ 3.76887 |
| 50 +: | $ 3.54715 |
| 100 +: | $ 3.32545 |
| 250 +: | $ 3.10376 |
| 500 +: | $ 2.88206 |
| 1000 +: | $ 2.82664 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.09°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are an essential component of thermal management, as they are used to dissipate heat away from critical components, such as power semiconductors and microprocessors, that generate a lot of heat during normal operation. The ATS-01D-72-C1-R0 heat sink is specifically designed for high-power, critical components to maintain optimal performance and optimal temperature in even the most challenging application environments.
The ATS-01D-72-C1-R0 heat sink is a two-part structure consisting of a cold plate and a heat sink stack. The cold plate is designed to interface directly with a component to be cooled, typically a power semiconductor, and is usually made of a highly thermally conductive material such as copper or aluminum. The cold plate has a large surface area in contact with the component to be cooled, which helps to quickly dissipate the heat generated during operation. The heat generated is then absorbed by the heat sink stack, which works to dissipate the heat away from the component as quickly as possible. This is done through a combination of convectional and radiative cooling.
To maximize efficiency, the ATS-01D-72-C1-R0 heat sink utilizes a radial fin design that maximizes surface area and provides additional cooling. The radial fins also enable the maximum thermal transfer from the component to the surrounding environment. This design also helps to reduce the facing area of the heat sink, as less surface area is exposed to the oncoming air. In addition, the heat sink is connected to a duct that allows cold air from outside the system to be drawn in. This cold airflow keeps the component cooler during operation and increases the efficiency of the overall thermal management system.
The ATS-01D-72-C1-R0 heat sink is designed to handle high-power, critical components that might otherwise be subject to overheating, thermal runaway, or even failure. With its robust design and efficient cooling, the ATS-01D-72-C1-R0 heat sink is the ideal choice for thermal management applications in industries such as automotive, industrial, computing, and telecommunications.
The specific data is subject to PDF, and the above content is for reference