ATS-01E-02-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.500" (12.70mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	18.29°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

ATS-01E-02-C1-R0 is an advanced thermal management solution designed specifically to mitigate thermal issues in electronics applications. The innovative design of the product ensures that it is able to meet the thermal requirements of high-end electronics applications, providing superior thermal performance with minimal effort and cost. The product features a unique double-layer heat sink structure and utilizes a patented flat surface wicking material, which helps to dissipate heat quickly and evenly. The combination of these two key features ensures improved thermal efficiency and enhanced stability in high-end electronics applications.The ATS-01E-02-C1-R0 thermal management solutions is suitable for a variety of applications including embedded computers, industrial automation, communication equipment, consumer electronics, medical devices and more.

Application Field

The ATS-01E-02-C1-R0 is designed to support a variety of electronic devices and applications, due to the unique double-layer heat sink structure and innovative flat surface wicking material. This product has the potential to provide superior thermal performance and stability for applications operating in high-end extended temperature ranges.The ATS-01E-02-C1-R0 is especially suitable for devices operating in extreme or hazardous conditions, such as those found in hazardous locations or other challenging environments. The advanced thermal solution has the ability to dissipate heat effectively, even under conditions such as vibration or high temperatures, thus reducing the risk of system damage.The product is also ideal for applications involving highly sensitive electronic components, such as those used in medical equipment or cleanroom robotics, as the thermally efficient design helps to ensure that the components remain within their specified operating temperature ranges.

Working Principle

The ATS-01E-02-C1-R0 is a unique thermal management solution designed to address thermal challenges in a variety of electronic applications. The product is comprised of two main components: the heat sink and the flat surface wicking material. The heat sink is designed to quickly and efficiently dissipate heat away from sensitive electronic components. The double-layer structure of the heat sink ensures enhanced thermal performance and stability and helps to increase the product’s overall thermal efficiency.The flat surface wicking material is a patented material designed specifically to efficiently transfer heat away from the heat sink and into the surrounding environment. This material helps to improve the speed at which the heat is dissipated, as well as providing improved thermal stability.The combination of these two components creates an advanced thermal management solution that is able to meet the demanding thermal requirements of a variety of high-end electronics applications. The product is able to dissipate heat quickly and evenly, thus improving thermal efficiency and stability, while reducing the risk of system damage.

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