| Allicdata Part #: | ATS-01E-07-C1-R0-ND |
| Manufacturer Part#: |
ATS-01E-07-C1-R0 |
| Price: | $ 3.31 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X12.7MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01E-07-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.00762 |
| 30 +: | $ 2.92635 |
| 50 +: | $ 2.76381 |
| 100 +: | $ 2.60127 |
| 250 +: | $ 2.43868 |
| 500 +: | $ 2.35738 |
| 1000 +: | $ 2.11351 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 16.97°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important aspect of electronic system design, as electronic components generate heat during operation, and proper cooling must be provided to ensure reliable operation. Heat sinks are one of the most effective thermal management solutions, providing an effective and efficient means of transferring heat away from the device, and dissipating it into the atmosphere. The ATS-01E-07-C1-R0 heat sink is a product from ATS Corp. designed to provide superior thermal management for a wide variety of applications.
The ATS-01E-07-C1-R0 heat sink is made from a combination of aluminum and copper for maximum efficiency. Aluminum has a high thermal conductivity, which allows heat to be transferred quickly and efficiently away from the device, while Copper has an even higher thermal conductivity, allowing for efficient heat transfer, even at high temperatures. The combination of aluminum and copper also provides strength and durability, allowing the heat sink to remain in top condition even after years of use.
The ATS-01E-07-C1-R0 is designed to provide superior cooling performance for a variety of applications. It is able to provide cooling for processors, memory chips, and other power electronics. The device features a high-performance finned surface, which helps to maximize the surface area and increase cooling capacity. It is also designed to be easy to install, and can be mounted directly to the device using screws or other mechanical fasteners.
The ATS-01E-07-C1-R0 also features a fanless design, which enables maximum cooling efficiency without the need for additional components. This helps to keep the device running at optimal levels even under high loads. The device also features an integrated heat spreader, which helps to reduce the risk of overheating. The integrated heat spreader helps to evenly spread the heat away from the device and improve cooling efficiency.
The working principle of the ATS-01E-07-C1-R0 is fairly simple. When the device is in use, the heatsink draws heat away from the processor or other electronics by means of conduction. As the heat is drawn away, it then dissipates into the atmosphere via convection. The heat spreader helps to evenly spread the heat away from the device, helping to reduce the risk of overheating.
The ATS-01E-07-C1-R0 is ideal for use in a variety of applications, from consumer electronics to high-end servers. It offers superior thermal management and cooling performance, while also providing ease of installation and a fanless design for maximum efficiency. It is an ideal solution for applications where space is limited or where an integrated cooling solution is not desired.
The specific data is subject to PDF, and the above content is for reference