| Allicdata Part #: | ATS-01E-117-C1-R0-ND |
| Manufacturer Part#: |
ATS-01E-117-C1-R0 |
| Price: | $ 3.09 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: | ATS-01E-117-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.78208 |
| 30 +: | $ 2.70669 |
| 50 +: | $ 2.55629 |
| 100 +: | $ 2.40591 |
| 250 +: | $ 2.25553 |
| 500 +: | $ 2.18034 |
| 1000 +: | $ 1.95479 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management devices, such as the ATS-01E-117-C1-R0 heat sinks, are essential components when it comes to managing the internal heat generated by electronic devices. Heat sinks help to dissipate the heat produced by electronic components, keeping them functioning at their optimal level. In this article, we will explore the application field and working principle of the ATS-01E-117-C1-R0 heat sink.
The ATS-01E-117-C1-R0 heat sink is designed to be used in a range of industrial applications. It is used to cool high-powered circuits such as power supplies, motors, amplifiers, and routers. The heat sink is also used in medical applications, where it can help to prolong the life of medical devices such as pacemakers. In addition, this type of heat sink is also used in automotive applications, where it helps to keep the temperature of the engine and other components in check.
The ATS-01E-117-C1-R0 heat sink works by making use of a process called ‘thermal conduction’. This process is when heat is transferred from a hotter object to a colder one by collisions of particles. In this case, an aluminum block attached to the circuit board transfers heat to fins connected to the aluminum block. The fins then disperse the heat into the surrounding air. This process ensures that the internal components of the electronic device remain cool, and can operate more efficiently.
The ATS-01E-117-C1-R0 heat sink is made from high-grade aluminum which offers superior heat dissipation. The fins are designed with precision to ensure maximum heat transfer. The heat sink is also designed to be lightweight but strong, making it easy to handle and mount. It also has a low profile design, allowing it to fit in tight spaces.
The ATS-01E-117-C1-R0 heat sink is a reliable and efficient thermal management device. It provides effective cooling of high-powered circuits, and helps to increase their lifetime. This heat sink is a great option for various industrial, medical, and automotive applications.
The specific data is subject to PDF, and the above content is for reference
ATS-01E-117-C1-R0 Datasheet/PDF