| Allicdata Part #: | ATS-01E-137-C3-R0-ND |
| Manufacturer Part#: |
ATS-01E-137-C3-R0 |
| Price: | $ 3.20 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X10MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01E-137-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.91249 |
| 30 +: | $ 2.83395 |
| 50 +: | $ 2.67649 |
| 100 +: | $ 2.51899 |
| 250 +: | $ 2.36157 |
| 500 +: | $ 2.28284 |
| 1000 +: | $ 2.04668 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.63°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management of electronic assemblies is one of the most important, yet often overlooked, aspects of any electronic system design. Heat is produced as a byproduct of normal operation, though it must be safely dissipated to avoid critical system failure. The ATS-01E-137-C3-R0 thermal-heat sink is a cost-effective solution to this problem. Designed with a copper base, extruded aluminum heatsink fins and a uniquely engineered air flow system, the ATS-01E-137-C3-R0 is designed to maximise heat transfer, dissipating heat quickly and reliably within almost any operating environment.
The ATS-01E-137-C3-R0 thermal-heat sink works in two primary ways. First, the copper base transfers thermal energy from the component to the fins of the heat sink, which in turn dissipate heat to the surrounding air through convection and radiation. Second, the innovative air flow system produces cross-ventilation, improving air circulation around the fins. This combination of thermal efficiency and air circulation allows the ATS-01E-137-C3-R0 to dissipate heat quickly and reliably within its operating environment.
The ATS-01E-137-C3-R0 can be used in any small form factor middle power applications, with thermal solutions ranging from 10 watts to 100W. It is suitable for a range of temperature and humidity levels, with several air flow configurations to suit various applications. It is also designed to minimize acoustic noise, and can be used in almost any type of environment, making it a versatile and reliable solution to removing excess heat from electronic systems.
The ATS-01E-137-C3-R0 is also remarkably easy to install. The extruded aluminum heatsink fins are designed to be simply attached to the component by two mounting screws, allowing for quick and painless installation. The air flow system also features integrated covers over the fan holes, preventing any dirt or dust infiltration and enabling virtually silent operation.
In addition to its thermal solutions, the ATS-01E-137-C3-R0 is aesthetically pleasing. The extruded aluminum fins are coated in an attractive black finish, reducing glare and adding a touch of class to any electronic system. The copper base is also designed to be flush with the heat sink, providing a sleek, slim profile when installed.
Overall, the ATS-01E-137-C3-R0 thermal-heat sink is an ideal choice for applications requiring efficient and reliable thermal solutions. By providing high performance solutions within a small form factor, the ATS-01E-137-C3-R0 is capable of dissipating heat quickly and quietly, while being aesthetically pleasing and easy to install. Making the ATS-01E-137-C3-R0 thermal-heat sink an extremely effective and versatile option in providing thermal management solutions for electronic systems.
The specific data is subject to PDF, and the above content is for reference