ATS-01E-139-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	0.984" (25.00mm)
Width:	0.984" (25.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	9.03°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to Thermal-Heat Sinks

Thermal-Heat Sinks are an essential component of many electrical systems. They draw in heat conducted from other components and dissipate it away from critical parts, increasing reliability and extending their lifespan. This application has been used in recent years to cool high performance systems, including CPUs, GPUs, and other specialized semiconductors.

ATS-01E-139-C1-R0 Design and Model Features

The ATS-01E-139-C1-R0 is a compact thermal-heat sink designed for applications with space constraints. Its design focuses on providing good performance at lower cost with its single-piece aluminum alloy construction. It has a size of 39 x 137.5 x 20mm, and a weight of only 472g.The ATS-01E-139-C1-R0 provides excellent thermal performance. It is able to provide excellent thermal management due to its powerful aluminum alloy fins that are laser-cut modeled into the top of its body, maximizing conductive heat transfer from the heated surface to the air. Additionally, it uses high-quality, thin-film oxide ceramic and aluminum construction for efficient heat dissipation.

Applications for ATS-01E-139-C1-R0

The ATS-01E-139-C1-R0 is suitable for applications that require a high level of thermal management in tight spaces. This includes speciality semiconductor components like GPUs, fPGAs, and CPUs, system memory modules, system boards, and other applications with high heat levels due to prolonged use.As the device can dissipate up to 40 Watts of heat, its applications are suitable for those who are looking for a high-performance cooling solution in a small form factor.

Working Principle of ATS-01E-139-C1-R0

The working principle of the ATS-01E-139-C1-R0 is quite simple. It is designed to absorb and dissipate the heat of nearby components into the environment using its aluminum alloy fins.When heat is generated from nearby components, the aluminum alloy fins draw the heat away and conduct it toward the alumina ceramic sheet at the base of the thermal-heat sink. The alumina ceramic sheet acts as a heat absorber, dissipating heat away from the component, which helps keep it from over-heating. The aluminum alloy fins then redirect the heat upward where it is dissipated into the environment through convection. This helps to maintain the components at a safe temperature level, enabling them to work optimally. This greatly increases the efficiency and reliability of the components, while also extending their lifespan.

Conclusion

The ATS-01E-139-C1-R0 is an excellent thermal-heat sink for applications in tight spaces. Its design enables it to provide high thermal management performance in a small form factor, making it suitable for complex, high-performance systems. Additionally, its compact size makes it easy to install in cramped spaces, and its powerful aluminum alloy fins ensure efficient heat transfer, providing excellent thermal management.

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