| Allicdata Part #: | ATS-01E-152-C3-R0-ND |
| Manufacturer Part#: |
ATS-01E-152-C3-R0 |
| Price: | $ 4.13 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X35MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01E-152-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.74787 |
| 30 +: | $ 3.53934 |
| 50 +: | $ 3.33119 |
| 100 +: | $ 3.12304 |
| 250 +: | $ 2.91483 |
| 500 +: | $ 2.70663 |
| 1000 +: | $ 2.65458 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important factor in many application fields including aerospace, automotive, medical, and automation. Heat sinks are an important part of any thermal management system. The ATS-01E-152-C3-R0 thermal heat sink works by dissipating heat by convective or conductive cooling from electronic components and devices.
This particular heat sink features a copper sidewall with a lanced fin design. This lanced fin design helps increase the amount of surface area exposed to airflow, which increases the heat dissipation effectiveness of the heat sink. The surface finish is a black anodized aluminum that is designed to increase the airflow through the sidewalls and around the fins while also preventing corrosion.
The ATS-01E-152-C3-R0 also features a unique flanged design which allows the heat sink to be mounted in different positions. This is an important feature to provide efficient convective cooling in different application environments. The heat sink can be mounted onto a flat surface such as a PCB board or used as a stand-alone component, depending on the application. The flange design also provides additional stability for the heat sink.
Additionally, the heat sink utilizes a standard mechanical interface. This is important to ensure compatibility with various thermal management systems including fans and other heatsinks. The standard mechanical interface allows for easy installation and removal of the heat sink in different application environments.
The ATS-01E-152-C3-R0 is designed for use in applications where air movement is minimal or non-existent. This type of heat sink uses a combination of convective and conductive cooling to dissipate heat. The convective cooling is achieved by natural airflow created by the surface finish of the heat sink, while the conductive cooling is caused by heat transfer between the heat sink and the component or device being cooled.
The ATS-01E-152-C3-R0 is also designed to be resistant to vibrations. This is important in applications such as aerospace and medical, where vibration can be a major source of component failure. The heat sink\'s construction ensures that it can withstand vibrations without suffering any damage or becoming loose.
The ATS-01E-152-C3-R0 thermal heat sink is designed for a wide range of applications and is an excellent choice for thermal management systems. The flanged design, standard mechanical interface, and resistance to vibrations make the ATS-01E-152-C3-R0 an ideal solution for many electronic components and devices. The lanced fin design and black anodized surface finish also ensure maximum heat dissipation effectiveness while preventing corrosion.
The specific data is subject to PDF, and the above content is for reference