| Allicdata Part #: | ATS-01E-154-C1-R0-ND |
| Manufacturer Part#: |
ATS-01E-154-C1-R0 |
| Price: | $ 3.56 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X15MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01E-154-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.23379 |
| 30 +: | $ 3.14622 |
| 50 +: | $ 2.97133 |
| 100 +: | $ 2.79657 |
| 250 +: | $ 2.62181 |
| 500 +: | $ 2.53441 |
| 1000 +: | $ 2.27223 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.48°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are essential components for any device that produces heat, particularly those that generate a lot of heat. The ATS-01E-154-C1-R0 is a thermal heat sink designed to dissipate heat away from sensitive components and regulate temperatures. By transferring heat from one object to another, the ATS-01E-154-C1-R0 helps to dissipate the heat generated and helps to keep components and systems cooler during heavy use.
This thermal heat sink is composed of several components, including a highly efficient heat conductor, a base plate, and thermal grease. The heat conductor is typically made of aluminum to increase its surface area and create an effective heat transfer path. The base plate reduces air pockets and acts as a heat spreader for the dissipated heat. The thermal grease is spread between the surfaces of the base plate and the heat conductor to ensure heat is quickly and efficiently transferred away.
The ATS-01E-154-C1-R0 is designed to operate in a wide range of temperatures, and its heat dissipation capability is maximized by the top-notch design. This heat sink includes a series of thermal fins attached to the surface of the heat conductor. These fins increase the surface area exposed to the ambient air, which allows heat to escape away faster than if the fins were not present. The heat conductor itself is designed to efficiently dissipate heat away from the components during operation.
This thermal heat sink can be used for a variety of purposes, from cooling small electronic components to larger servers and data centers. Its efficiency in transferring and dissipating heat away from sensitive components allows it to be used in a wide range of applications. In addition, its lightweight design makes it easy to install in tight spaces and cooling solutions.
The ATS-01E-154-C1-R0 is versatile and can be used in a range of temperatures and conditions. Its high-performance design provides superior heat dissipation for effective cooling and increased component reliability. Its thermally efficient design ensures that heat generated from the components is dissipated away effectively while also providing protection from overheating. This thermal heat sink is a reliable and cost-efficient solution for managing temperatures and providing superior cooling.
The specific data is subject to PDF, and the above content is for reference