ATS-01E-159-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-01E-159-C1-R0-ND

Manufacturer Part#:

ATS-01E-159-C1-R0

Price: $ 3.56
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X10MM L-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-01E-159-C1-R0 datasheetATS-01E-159-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.23379
30 +: $ 3.14622
50 +: $ 2.97133
100 +: $ 2.79657
250 +: $ 2.62181
500 +: $ 2.53441
1000 +: $ 2.27223
Stock 1000Can Ship Immediately
$ 3.56
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 10.68°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-01E-159-C1-R0 Heat Sink is an extremely versatile and powerful product that is able to function in a multitude of different fields. In this article, we will explore the various applications and working principles of the ATS-01E-159-C1-R0 Heat Sink specifically.

As the name implies, the ATS-01E-159-C1-R0 Heat Sink is primarily used for cooling purposes. It works by moving heat away from components that generate it, such as controller boards, LED lights, solid state drives, or printed circuit boards. Heat sinks are typically mounted directly onto these components, usually with the help of thermal paste, allowing them to conduct heat away from the surface and into the sink. The heat sink then releases this heat in the form of a cool breeze.

However, the ATS-01E-159-C1-R0 Heat Sink is much more than just a cooling solution. The heat sink also has a wide range of other uses and applications. For example, it can be used to dissipate electro-magnetic interference (EMI) from electrical components, which can cause signal disruption and data loss in electronics systems. It can also be used as insulation, shielding sensitive components from the ambient heat around them.

The ATS-01E-159-C1-R0 Heat Sink works by transferring heat away from components via a combination of convection and conduction. When a component generates heat, the heat is transferred to the heat sink via thermal conduction. The heat is then dissipated by convection, as air passes over the heat sink and carries the heat away with it.

The ATS-01E-159-C1-R0 Heat Sink is designed to be highly efficient in order to maximize heat transfer. The large size of the heat sink ensures maximum surface area, providing more space for convection to dissipate the heat. The shape of the heat sink is also carefully designed to maximize air flow, thus increasing its cooling capabilities.

The ATS-01E-159-C1-R0 Heat Sink is highly customizable, allowing users to choose the size, shape, and material of the heat sink depending on their needs. For example, the ATS-01E-159-C1-R0 Heat Sink is available in sizes ranging from 101mm x 101mm to 406mm x 406mm. It is also available in a variety of different shapes, including circular, rectangular, and triangular.

The ATS-01E-159-C1-R0 Heat Sink also comes in a variety of materials, including aluminum, copper, and graphite. Each type of material has its own advantages and disadvantages, so it is important to consider which solution would be best for the given application. Furthermore, the ATS-01E-159-C1-R0 Heat Sink also features a variety of connecting options, such as screw-in, press-in, and clip. This variety of options allows users to easily connect and mount the heat sink to the component or circuit board, making it easy to install and easy to maintain.

All in all, the ATS-01E-159-C1-R0 Heat Sink is a highly versatile and powerful product that is capable of providing efficient cooling in a wide range of applications. It is highly customizable, allowing users to choose the size, shape, and material of the heat sink depending on their needs. Additionally, it is easy to install and maintain, making it an ideal solution for any cooling application.

The specific data is subject to PDF, and the above content is for reference

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