| Allicdata Part #: | ATS-01E-160-C3-R0-ND |
| Manufacturer Part#: |
ATS-01E-160-C3-R0 |
| Price: | $ 4.32 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X15MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01E-160-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.88647 |
| 30 +: | $ 3.67059 |
| 50 +: | $ 3.45467 |
| 100 +: | $ 3.23870 |
| 250 +: | $ 3.02279 |
| 500 +: | $ 2.80687 |
| 1000 +: | $ 2.75290 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.75°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are an important component in thermal management applications, designed to dissipate heat away from hot components and reduce temperature rise. The ATS-01E-160-C3-R0 is a special type of heat sink that is designed for electronic applications. This article will discuss the application field and working principle of the ATS-01E-160-C3-R0.
The ATS-01E-160-C3-R0 is a high performance heat sink designed for use in electronic components such as CPU, chipset, memory, and graphics cards. It is constructed from aluminum, which is an excellent thermal conductor, ensuring efficient heat dissipation. The heat sink has a curved design, with an aerodynamic shape that maximizes its surface area and airflow rate. This increases its cooling capacity and makes it ideal for overclocking applications.
The ATS-01E-160-C3-R0 features an innovative cooling technology, called DirectCompress. This technology uses a combination of fins, channels, and grooves to increase the surface area of the heat sink while also allowing for greater heat dissipation. The technology reduces the amount of energy needed for cooling, helping optimize system performance while also helping reduce energy costs.
The ATS-01E-160-C3-R0 also features a unique mounting system, which makes installation and maintenance easier. This system also helps improve efficiency, as it prevents the heat sink from coming loose, even when subjected to high temperatures or vibrations. The mounting system is also flexible, allowing the ATS-01E-160-C3-R0 to be installed in a variety of positions, depending on the application.
In addition to its impressive features, the ATS-01E-160-C3-R0 also has a variety of applications. It is particularly well suited for electronic devices, including CPU, graphics card, and memory chips. It is also ideal for use in industrial applications that require high heat dissipation. Due to its impressive performance, it can be used for gaming PCs, servers, workstations, and other computer systems.
The ATS-01E-160-C3-R0 works by drawing heat away from the component that is generating it. This is made possible by the combination of its efficient design and the direct compress technology, which helps increase heat dissipation. The heat sink also has a number of fins that are designed to help increase the surface area of the heat sink, which helps it dissipate heat quickly and evenly. This ensures that the device will be able to operate at optimal temperatures, ensuring efficient performance and a longer lifespan.
In conclusion, the ATS-01E-160-C3-R0 is a high performance heat sink that is designed for use in a variety of applications. It features an innovative cooling technology and an efficient mounting system, which makes it ideal for electronic components such as CPUs, graphics cards, and memory chips. The heat sink is also well suited for industrial applications that require high heat dissipation. All in all, the ATS-01E-160-C3-R0 is a great choice for anyone looking for an efficient way to cool down their devices and components.
The specific data is subject to PDF, and the above content is for reference