
Allicdata Part #: | ATS-01E-170-C1-R0-ND |
Manufacturer Part#: |
ATS-01E-170-C1-R0 |
Price: | $ 3.35 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 30X30X15MM R-TAB |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 3.04353 |
30 +: | $ 2.96100 |
50 +: | $ 2.79657 |
100 +: | $ 2.63208 |
250 +: | $ 2.46758 |
500 +: | $ 2.38533 |
1000 +: | $ 2.13857 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.181" (30.00mm) |
Width: | 1.181" (30.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.590" (15.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 10.02°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat sinks are used to manage thermal energy within equipment and components. ATS-01E-170-C1-R0 is a high quality heatsink designed for the demands of industry. It is specifically designed for effective thermal management of circuit boards, components, power systems, and other electronic products.The ATS-01E-170-C1-R0 is designed with a unique aluminum fin structure that maximizes the surface area for heat dissipation. The dissipated heat is then propelled away from the system by convection forces. The convection forces allow the heat to be spread out over a larger area, resulting in more effective cooling. The fin structure also increases the thermal resistance, allowing the heat to be more efficiently dissipated. The ATS-01E-170-C1-R0 has a low profile design, making it easy to install even in tight spaces. Its robust construction and long lasting durability make it suitable for use in industrial applications. The heatsink also has a built-in airflow guide to keep the temperature of the components within the thermal enclosure consistent. The ATS-01E-170-C1-R0 is designed to be compatible with various types of components, including CPU chipsets, graphics processors, and power systems. The heatsink can be used to cool components such as processors, memory chips, and other power components. The thermal capacity of the heatsink ensures that these components can stay cool even when running at high loads. The ATS-01E-170-C1-R0 comes with a highly efficient cooling mechanism. Its efficient heat-dissipating design ensures that the components within the thermal enclosure remain cool, even under heavy loads. The heat-sink comes with an integrated thermal throttle, which helps manage the heat within the thermal enclosure. The thermal throttle also helps guarantee a reliable thermal management of the components in the thermal enclosure. The ATS-01E-170-C1-R0 is also designed with an integrated thermal cut-off feature. This feature ensures the safety of the components in the thermal enclosure by cutting off the power supply in case of a temperature rise beyond the set limit. The thermal cut-off feature also helps maintain the life of the components in the thermal enclosure.The ATS-01E-170-C1-R0 is an effective solution for cooling components and systems. Its efficient heat dissipation and robust construction make it suitable for use in industrial applications. The thermal capacity and integrated features of the heatsink ensure that the components remain cool even under heavy loads. Its low profile design makes it easy to install in tight spaces and its long lasting durability makes it perfect for long term applications.
The specific data is subject to PDF, and the above content is for reference