| Allicdata Part #: | ATS-01E-196-C3-R0-ND |
| Manufacturer Part#: |
ATS-01E-196-C3-R0 |
| Price: | $ 3.47 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X6MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01E-196-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.15063 |
| 30 +: | $ 3.06516 |
| 50 +: | $ 2.89498 |
| 100 +: | $ 2.72462 |
| 250 +: | $ 2.55435 |
| 500 +: | $ 2.46919 |
| 1000 +: | $ 2.21376 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.236" (6.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.26°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is important for the proper functioning of modern electronic devices. Without a proper thermal management system, the device will suffer from component failures due to overheating. The ATS-01E-196-C3-R0 is a highly efficient thermal management solution designed to effectively protect devices from excessive heat, allowing for more reliable operation in harsh environments.
The ATS-01E-196-C3-R0 is a thermal heat sink that is specifically designed for electronic devices. It is a highly efficient aluminum extruded heat sink that utilizes the natural properties of aluminum, such as its excellent thermal conductivity, its high strength, its light weight, and its low cost. The ATS-01E-196-C3-R0 features a highly efficient fins design that efficiently dissipate heat away from a device. The fins design increases the surface area, allowing for more effective heat dissipation while also allowing for directional control of the air flow. The ATS-01E-196-C3-R0 also features an integrated heatsink package that ensures superior performance.
In addition to its excellent thermal performance, the ATS-01E-196-C3-R0 features several design advantages that make it ideal for protecting electronic devices. The device features a single-slot installation design that makes it ideal for use in tight spaces, and its compact size makes it an excellent choice for embedded systems. The device also features an easy installation process and a connector system that is compatible with the majority of the most popular electronic devices.
The working principle of the ATS-01E-196-C3-R0 is based on the transfer of heat from the electronic device to the air surrounding it. Heat is generated by the electronic device due to its operation, and the heat sink acts as a conduit for the transfer of this heat energy. The heat sink utilizes the natural properties of aluminum, such as its high thermal conductivity, to dissipate heat away from the device. The fins on the heat sink increase the surface area, allowing for more efficient heat dissipation. Air flow is directed by the fins design to further improve heat dissipation while also ensuring noise reduction.
The ATS-01E-196-C3-R0 is an excellent choice for thermal management in modern electronic devices. The device is highly efficient and features an integrated heatsink package for superior thermal performance. The device is also easy to install and is compatible with the majority of the most popular electronic devices. The natural properties of aluminum, such as its high thermal conductivity, make it a highly efficient heat sink, and its design advantages, such as its single-slot installation and compact size, make it ideal for use in embedded systems. All in all, the ATS-01E-196-C3-R0 is an excellent thermal management solution for electronic devices.
The specific data is subject to PDF, and the above content is for reference