
Allicdata Part #: | ATS-01E-198-C3-R0-ND |
Manufacturer Part#: |
ATS-01E-198-C3-R0 |
Price: | $ 3.58 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 45X45X12MM XCUT T412 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 3.25710 |
30 +: | $ 3.16932 |
50 +: | $ 2.99326 |
100 +: | $ 2.81717 |
250 +: | $ 2.64109 |
500 +: | $ 2.55305 |
1000 +: | $ 2.28894 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.772" (45.00mm) |
Width: | 1.772" (45.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.472" (12.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 9.21°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
ATS-01E-198-C3-R0 (referred to here as ATS-C3) is a thermal solution specifically designed for the heat sink market. ATS-C3’s application field is as versatile as its production methods in that it can be utilized in a variety of sites such as consumer electronics, industrial electronics, and aerospace. Moreover, its complex operation allows for a wide range of applications, ranging from air cooling to water cooling, depending on the type of application. This document explains the application field and working principle of this product.
ATS-C3 is designed to provide a reliable and efficient thermal solution to the heat sink market. The product is suitable for consumer electronics such as laptop computers, desktops, and servers. It can also be used in industrial electronics such as solar cells, semiconductors, and LED lighting. Furthermore, the product’s intricate design allows it to be used in aerospace applications as well. It can be used to cool avionics and other mission-critical components in aircraft.
The ATS-C3 utilizes a unique design which is capable of converting heat energy to useful work. It begins with the radiative heat source. The source heats up a metal heat spreader which then absorbs the heat energy and transfers it to the fins. The fins increase the surface area of the heat spreader and allow for greater amounts of heat energy to be absorbed. The fins are then cooled via convection and radiation by a heat pipe or fan which dissipates the heat energy away from the device.
The ATS-C3 also features a microchannel cold plate which is used to increase heat transfer efficiency. The microchannel cold plate utilizes grooves to increase the surface area of the heat spreader which allows for greater amounts of energy to be absorbed. This absorption of energy then causes the internal pressure difference within the microchannel to rise which forces hot gas to be expelled from the cold plate. The expelled gas is then used to further increase the efficiency of the device.
The ATS-C3 also utilizes thermoelectric cooling. Thermoelectric cooling is a process in which heat is transferred by an electrical current. ATS-C3 employs this technology by using a thermoelectric module (TEM) to convert the heat energy to a usable electrical current which is then used to increase the temperature of the cold side. This process helps to reduce the amount of energy needed to cool down the device and maintains a consistent temperature across the entire device.
The ATS-C3 is a highly versatile thermal solution designed to fit the heat sink market. It can be used in a variety of applications such as consumer electronics, industrial electronics, and aerospace. The unique design of the product is capable of converting heat energy into useful work via its radiative heat source, fins, microchannel cold plate, and thermoelectric cooling. Lastly, the product also helps to reduce energy consumption and maintain a consistent temperature across the entire device, making it a perfect choice for those seeking an efficient and reliable heat sink solution.
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