ATS-01E-26-C3-R0

Heat sinks are an essential component in modern electronic designs. They are necessary for removing the heat that is generated by the device or system in order to keep its internal components and its surroundings safe. Heat sinks are typically made of thermally conductive materials, such as aluminum, copper, and graphite, and they come in a variety of shapes and sizes. The ATS-01E-26-C3-R0 is a type of thermal heat sink that is used for applications in a wide range of products, including LEDs, power devices, ICs, optoelectronics, and embedded systems.

The ATS-01E-26-C3-R0 heat sink consists of an extruded aluminum finned design. It has a base plate, a steel mounting bracket, and a single aluminum fin that is 0.3 mm thick. The structure consists of two layers of sheets, the top layer consisting of four aluminum sheets stacked together and the bottom layer consisting of two aluminum sheets. The top sheet is located directly above the aluminum fin, while the bottom sheet is placed underneath the fin. The mounting bracket has two holes for mounting the heat sink securely to a device.

The ATS-01E-26-C3-R0 heat sink provides excellent heat dissipation from the device or system it is used with. It has a thermal resistance of 0.304 °C/W, which is lower than most other heat sinks. This allows the heat to be effectively transferred away from the device to ensure its safe operation. The low thermal resistance also decreases the risk of the device overheating, providing a safe and reliable performance.

The ATS-01E-26-C3-R0 heat sink is a versatile design and is perfect for a wide range of applications. It can be used in embedded systems, power devices, LEDs, ICs, and optoelectronics. It is suitable for applications that require a highly efficient thermal management solution. It is particularly suitable for applications in high-density devices, which require a high degree of heat dissipation.

The working principle of the ATS-01E-26-C3-R0 heat sink is the same as all other heat sinks. Heat generated by the device is transferred to the fins of the heat sink via conduction. The fins then spread the heat and conduct it through the air, dissipating the heat away from the device or system. This ensures that the temperature is kept within an acceptable range to avoid damage to the device.

The ATS-01E-26-C3-R0 heat sink is a reliable and efficient thermal management solution. It has a low thermal resistance and provides excellent heat dissipation for a variety of applications. It is a versatile design with a steel mounting bracket and is suitable for use with a variety of components. This heat sink is an ideal solution for thermal management in a wide range of devices and systems.