| Allicdata Part #: | ATS-01E-38-C2-R0-ND |
| Manufacturer Part#: |
ATS-01E-38-C2-R0 |
| Price: | $ 6.15 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 36.83X57.6X22.86MM T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01E-38-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.52888 |
| 30 +: | $ 5.22186 |
| 50 +: | $ 4.91463 |
| 100 +: | $ 4.60744 |
| 250 +: | $ 4.30028 |
| 500 +: | $ 3.99312 |
| 1000 +: | $ 3.91632 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.450" (36.83mm) |
| Width: | 2.267" (57.60mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.900" (22.86mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.42°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are a type of thermal control device typically used in electronic equipment. ATS-01E-38-C2-R0 thermal-heat sinks are efficient and cost-effective solutions for cooling in any environment. Heat sinks are most commonly used to dissipate heat from a variety of components such as transistors, voltage regulators, diodes, and other thermal-sensitive semiconductor devices.ATS-01E-38-C2-R0 thermal-heat sinks are designed to provide a precise thermal interface between the underlying component and outer environment. They employ either single or multiple heat-transfer fin assemblies to dissipate heat along the entire length of the fins. This allows for a greater heat dissipation area and effective heat transfer to the ambient environment. The fins are constructed using a variety of different materials including aluminum and copper for optimal performance.The ATS-01E-38-C2-R0 thermal-heat sink contains an integrated fan to help increase the device’s overall efficiency and cooling performance. This fan helps to enhance the flow of air over the fins, further improving cooling performance. In addition, due to their lightweight and rigid construction, these thermal-heat sinks can easily be installed in a variety of different applications.
The ATS-01E-38-C2-R0 thermal-heat sink also contains an efficient and low-cost heat-conducting material. This material helps to maximize thermal transfer from the underlying component to the outer environment. It also ensures a secure thermal transfer connection between the sink and the component. The material acts as an insulation barrier, protecting the underlying component from thermal gradients and fluctuations. The material can also be designed to varying thicknesses and conform easily to different components.
The ATS-01E-38-C2-R0 thermal-heat sink’s design with an integrated fan and various materials ensures its efficient cooling performance. The materials help to maximize thermal transfer and ensure a secure connection between the sink and the component. The fan helps to enhance the flow of air over the fins and further increases the device’s overall cooling performance. The entire assembly is lightweight and rigid for easy installation in various applications. Moreover, the ATS-01E-38-C2-R0 thermal-heat sink is cost-effective and efficient, making it an excellent choice for cooling any electronic device.
The specific data is subject to PDF, and the above content is for reference