| Allicdata Part #: | ATS-01E-40-C2-R0-ND |
| Manufacturer Part#: |
ATS-01E-40-C2-R0 |
| Price: | $ 6.52 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X60.96X11.43MM T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: | ATS-01E-40-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.86467 |
| 30 +: | $ 5.53854 |
| 50 +: | $ 5.21275 |
| 100 +: | $ 4.88697 |
| 250 +: | $ 4.56117 |
| 500 +: | $ 4.23538 |
| 1000 +: | $ 4.15393 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 2.400" (60.96mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.450" (11.43mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.56°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a critical engineering requirement that has implications for the overall performance, reliability, and cost of electronic and electrical systems, machines and equipment. ATS-01E-40-C2-R0 is a special type of heat sink that has been designed specifically to meet these needs in a wide range of applications.
Heat sinks are designed to draw heat away from components and dissipate it so that the components don\'t overheat and damage themselves. Heat sinks are basically large metal structures that have a high coefficient of thermal conductivity, which allows them to draw heat away from components quickly. The material used for the structure of a heat sink is usually aluminum or copper, as these materials have been found to be extremely effective for heat transfer.
The ATS-01E-40-C2-R0 is a particular type of heat sink that has been designed for use in relatively small electronic components, such as microprocessors and other integrated circuits. It uses a combination of fins and grooved channels, which are designed to draw heat away from the component quickly and uniformly. The fins also help to increase the surface area of the heat sink, allowing it to dissipate more heat. The grooved channels are designed to direct the flow of air through the heat sink, which helps to cool the component further.
In operation, the heat sink will typically be mounted directly to the electronic component or on the circuit board itself. This allows the heat from the component to be transferred directly to the heat sink, which helps to ensure that the component does not overheat. The heat sink can then act as a buffer, keeping the component from reaching temperatures that could cause permanent damage. This allows for higher clock speeds and more efficient operation of the component.
Aside from this application, heat sinks can also be used in applications such as automotive, industrial, and medical electronics, as they can help to ensure a safe working environment. In a medical or industrial application, for example, a heat sink can help to protect sensitive components from sudden changes in temperature, which could result in malfunction or damage. The design of the ATS-01E-40-C2-R0 heat sink makes it ideal for these types of applications, as it is specifically designed to cope with the pressures and temperatures associated with these environments.
Overall, the ATS-01E-40-C2-R0 heat sink is a very effective and versatile design, suitable for a wide range of applications. Its combination of fins and grooved channels makes it an excellent choice for thermal management in smaller components, while its rugged construction makes it ideal for more demanding applications. Its low cost and high thermal conductivity make it an ideal choice for any application where thermal management is essential.
The specific data is subject to PDF, and the above content is for reference
ATS-01E-40-C2-R0 Datasheet/PDF