ATS-01E-59-C3-R0

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Thermal - Heat Sinks

The ATS-01E-59-C3-R0 is a type of heat sink ideal for thermal management in many types of application fields. A heat sink is a device that removes heat from a chip, component, or other device, by dissipating it away to the surrounding air. It includes a passive cooling system of fins that surround a central heat-transfer body, allowing air to move freely around the heat transfer body and through the fins, whisking away the heat. It is a cost-effective option for thermal management.

Applications

The ATS-01E-59-C3-R0 heat sink is suitable for a wide range of application fields, including computers, telecommunications hardware, consumer electronics, lighting equipment, industrial equipment, automobile electronics, and medical electronics. It can be used in applications where a fan or liquid cooling system is not feasible, such as confined spaces and portable devices that need to be energy efficient. It is a common choice for applications that require low-profile, weight-reduced assemblies with a higher thermal performance than passive cooling. The heat sink’s ability to dissipate heat reliably allows it to be used in high-power applications as well.

Working Principle

The ATS-01E-59-C3-R0 incorporates a unique design which maximizes the airflow across its surface. The heat sink consists of a metal core surrounded by an array of fins which are molded or extruded from aluminum or copper. The core serves as the interface with the object generating heat, and the fins accelerate the rate of cool air exchange and heat dissipation by increasing the surface area exposed to the air. As air passes through the fins, the heated air is absorbed by the metal core, taking some of the heat away with it as it passes. The cooled air is then dispersed by the fins, and is replaced by cooler air, thus providing continuous cooling.

Efficiency

The ATS-01E-59-C3-R0 offers efficient thermal performance over a wide range of operating conditions. Its design allows it to remain effective even when working in the presence of dust and dirt, as the fins are built with a high tolerance for pollutants. The heat sink has a high thermal conductivity, making it perfect for applications that generate high levels of heat. Additionally, its lightweight design makes it ideal for mobile electronics, where minimizing weight is important.

Conclusion

The ATS-01E-59-C3-R0 heat sink is a cost-effective solution for thermal management in applications such as computers, telecommunications hardware, consumer electronics, lighting equipment, industrial equipment, automobile electronics, and medical electronics. It features a unique design which maximizes the airflow across its surface, allowing it to remain efficient even in the presence of dust and dirt. The heat sink is lightweight and has a high thermal conductivity, making it the perfect choice for applications that generate high levels of heat.

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