| Allicdata Part #: | ATS-01E-63-C1-R0-ND |
| Manufacturer Part#: |
ATS-01E-63-C1-R0 |
| Price: | $ 3.72 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01E-63-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.37617 |
| 30 +: | $ 3.28503 |
| 50 +: | $ 3.10250 |
| 100 +: | $ 2.91999 |
| 250 +: | $ 2.73748 |
| 500 +: | $ 2.64622 |
| 1000 +: | $ 2.37248 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.29°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal solutions are essential components in modern electronic systems. As they play an important role in dissipating heat produced by the components, the performance and reliability of the system is closely related to the thermal solution. Heat sinks, namely ATS-01E-63-C1-R0, are a kind of passive heat exchange components which are widely used to dissipate heat generated by some high power electronic components.
The ATS-01E-63-C1-R0 heat sinks are mainly composed of a base, a fin, and a heat pipe. The base is mainly used to provide a solid foundation for the heat transfer and thermal dissipation from the heat source to the fins. The fin is usually made of aluminum and has a large number of small and uniform ventilation holes, which can ensure sufficient ventilation and take away the heat quickly and evenly. The heat pipe is usually made of copper and provides a circulating heat transfer for the fins.
The working principle of the ATS-01E-63-C1-R0 heat sinks is based on convection heat transfer. Heat is transferred from the heat source to the fins of the heat sinks through the base. The heat is then dissipated to the surrounding air by the fins. At the same time, the heat pipe in the internal structure of the heat sink can rapidly transfer the thermal energy from the fins to further reduce the temperature of the heat air. Overall, through convective heat transfer, the ATS-01E-63-C1-R0 heat sink can quickly and effectively dissipate heat.
In terms of applications, ATS-01E-63-C1-R0 heat sinks are widely used in various fields. In the semiconductor field, they are widely used in high power electronic components such as CPU, GPU, SOC, etc. to dissipate the heat generated by the components and improve the performance and reliability of the system. In addition, they can also be used in power supply systems and LED lighting devices, where heat needs to be dissipated rapidly to maintain a stable temperature. Other applications include power electronic devices, controller boards, radiator systems, and more.
In summary, the ATS-01E-63-C1-R0 heat sink is a highly reliable thermal solution which is widely used by various electronics industries because of its excellent performance in convective heat transfer and effective dissipation of high power components. With its wide range of applications, it is an ideal choice for optimizing the performance and reliability of numerous electronic systems.
The specific data is subject to PDF, and the above content is for reference