| Allicdata Part #: | ATS-01E-68-C1-R0-ND |
| Manufacturer Part#: |
ATS-01E-68-C1-R0 |
| Price: | $ 3.56 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X15MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-01E-68-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.23379 |
| 30 +: | $ 3.14622 |
| 50 +: | $ 2.97133 |
| 100 +: | $ 2.79657 |
| 250 +: | $ 2.62181 |
| 500 +: | $ 2.53441 |
| 1000 +: | $ 2.27223 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.29°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are a specialized type of cooling technology designed to transfer thermal energy away from electronic components. The ATS-01E-68-C1-R0 is a type of thermal-heat sink designed to dissipate heat away from sensitive components while ensuring a long service life. This particular heat sink is designed with a unique fin profile and is suited for multiple temperature profile applications.
The ATS-01E-68-C1-R0 has a unique fin profile and is designed with a combination of aluminum and copper to create an effective thermal transfer. The specific combination of aluminum and copper helps to ensure maximum heat dissipation with a low thermal resistance. The heat sink also has a low profile design that allows the sink to take up less space when mounted. This makes the ATS-01E-68-C1-R0 a great choice for applications that require minimal space but maximum cooling efficiency.
The ATS-01E-68-C1-R0 is designed to work efficiently in multiple temperature applications. It can be used in a range of environments, including high and low temperatures. The low thermal resistance of the fins allows it to transfer heat away from the components efficiently and with long-lasting effects. In addition, the low profile design makes the installation process quick and easy.
The ATS-01E-68-C1-R0 has been designed to work with a variety of components. It is capable of being used with a range of integrated circuits, such as transistors, switching regulators, and MOSFETs. It can also be used with components that have limited space restrictions, such as in embedded systems. Additionally, the heat sink can also be used for applications requiring a lower profile design, such as cooling laptops, GPUs, and other high-performance components.
The working principle of the ATS-01E-68-C1-R0 is fairly simple. The heat sink utilizes a combination of natural convection and conduction to move heat away from the component. The structure of the sink features many low contact areas with the device being cooled, which helps to quickly dissipate heat. Additionally, the fin profile allows for a more efficient transfer of thermal energy away from the device.
One of the key uses for the ATS-01E-68-C1-R0 heat sink is in the cooling of computer components. The unique fin profile helps to move heat away from the device rapidly and efficiently without placing too much load on the components. This heat sink is also used in applications that require high levels of heat dissipation and a low profile, such as in laptops, GPUs, and other devices. Additionally, the heat sink can also be used in embedded systems and for industrial controls.
The ATS-01E-68-C1-R0 is a great option for applications requiring efficient heat dissipation with a low thermal resistance. The unique fin profile and combination of aluminum and copper provide maximum heat dissipation. The low profile design also helps to reduce installation time and ensure a more compact overall design. All of these features make the ATS-01E-68-C1-R0 a great choice for cooling computer components, embedded systems, industrial controls, and any other application that requires reliable thermal transfer.
The specific data is subject to PDF, and the above content is for reference