ATS-01E-91-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-01E-91-C1-R0-ND

Manufacturer Part#:

ATS-01E-91-C1-R0

Price: $ 3.31
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X10MM R-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-01E-91-C1-R0 datasheetATS-01E-91-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.00762
30 +: $ 2.92635
50 +: $ 2.76381
100 +: $ 2.60127
250 +: $ 2.43868
500 +: $ 2.35738
1000 +: $ 2.11351
Stock 1000Can Ship Immediately
$ 3.31
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 21.94°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal heat sinks are essential components of equipment with high power components. They are designed to transfer heat from components to the air or water for cooling. The ATS-01E-91-C1-R0 is a designed for use with high wattage components needing effective thermal management. Understanding its application field and working principle can help implement and proper use of this new technology.

The ATS-01E-91-C1-R0 is designed for use with high wattage components such as power supplies, amplifiers, converters and other components needing effective thermal management. It is a combination of copper and aluminum alloy and has large heat transfer area, which is suitable for dissipating large amount of heat generated in the operation of these components. The thermal resistance of this heat sink is minimized, making it ideal for dissipating large amounts of heat quickly and efficiently.

The ATS-01E-91-C1-R0 provides a number of advantages for applications that require effective thermal management. It is designed to dissipate heat quickly and efficiently with minimal thermal resistance, ensuring that components remain within operating specifications. It is constructed for easy installation in equipment, providing a convenient solution for thermal management. The rugged construction of this heat sink ensures long-term performance and increased reliability.

The working principle of the ATS-01E-91-C1-R0 heat sink is based on the conduction and convection of heat. The thermal transmittance of the material used in the construction of the heat sink is designed to enable efficient heat transfer. Heat from the component is transferred from its surface to the surrounding air. This heat is in turn redirected through the medium of heat transfer to the colder region. Once the heat is released from the component, the surface of the heat sink and the material dissipates it efficiently.

The ATS-01E-91-C1-R0 heat sink can be installed in a variety of locations requiring thermal management. It is a popular choice for use in telecommunication, medical, industrial, automotive and other applications where efficient heat transfer and cooling are required. The heat sink is also suitable for use in computers, cabinets and enclosures. The thermal performance of this heat sink makes it a reliable choice for use in any application requiring effective thermal transfer.

The ATS-01E-91-C1-R0 is a highly effective heat sink for use with components requiring efficient thermal management. It has a high thermal transmittance and a rugged construction, providing reliable and long-term performance. The ease of installation and thermal characteristics of this heat sink makes it an ideal choice for various applications requiring heat transfer and cooling. Utilizing the ATS-01E-91-C1-R0 Heat Sink with appropriate power components can ensure reliable and efficient thermal management.

The specific data is subject to PDF, and the above content is for reference

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